SBOS371B August   2006  – October 2014 TMP401

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: V+ = 3 V to 5.5 V
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Standard and Extended Temperature Measurement Range
      2. 7.3.2 Remote Sensing
    4. 7.4 Device Functional Modes
      1. 7.4.1 SMBus Alert Function
      2. 7.4.2 THERM (Pin 4) and ALERT/THERM2 (Pin 6)
      3. 7.4.3 Sensor Fault
      4. 7.4.4 High-Speed Mode
      5. 7.4.5 Shutdown Mode (SD)
      6. 7.4.6 One-Shot Conversion
      7. 7.4.7 General-Call Reset
    5. 7.5 Programming
      1. 7.5.1 Bus Overview
      2. 7.5.2 Serial Interface
      3. 7.5.3 Serial Bus Address
      4. 7.5.4 Read and Write Operations
      5. 7.5.5 Timeout Function
      6. 7.5.6 Timing Diagrams
    6. 7.6 Register Maps
      1. 7.6.1  Pointer Register
      2. 7.6.2  Temperature Registers
      3. 7.6.3  Limit Registers
      4. 7.6.4  Status Register
      5. 7.6.5  Configuration Register
      6. 7.6.6  Resolution Register
      7. 7.6.7  Conversion Rate Register
      8. 7.6.8  Identification Registers
      9. 7.6.9  Consecutive Alert Register
      10. 7.6.10 THERM Hysteresis Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Filtering
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Series Resistance Cancellation
        2. 8.2.3.2 Differential Input Capacitance
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Measurement Accuracy and Thermal Considerations
      2. 10.1.2 Layout Considerations
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.