SPRS797C November   2012  – October 2018 TMS320F28050 , TMS320F28051 , TMS320F28052 , TMS320F28053 , TMS320F28054 , TMS320F28055

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
      1. Table 5-1 TMS320F2805x Current Consumption at 60-MHz SYSCLKOUT
      2. 5.4.1     Reducing Current Consumption
      3. 5.4.2     Current Consumption Graphs (VREG Enabled)
    5. 5.5  Electrical Characteristics
    6. 5.6  Thermal Resistance Characteristics for PN Package
    7. 5.7  Thermal Design Considerations
    8. 5.8  Emulator Connection Without Signal Buffering for the MCU
    9. 5.9  Parameter Information
      1. 5.9.1 Timing Parameter Symbology
      2. 5.9.2 General Notes on Timing Parameters
    10. 5.10 Test Load Circuit
    11. 5.11 Power Sequencing
      1. Table 5-3 Reset (XRS) Timing Requirements
      2. Table 5-4 Reset (XRS) Switching Characteristics
    12. 5.12 Clock Specifications
      1. 5.12.1 Device Clock Table
        1. Table 5-5 2805x Clock Table and Nomenclature (60-MHz Devices)
        2. Table 5-6 Device Clocking Requirements/Characteristics
        3. Table 5-7 Internal Zero-Pin Oscillator (INTOSC1, INTOSC2) Characteristics
      2. 5.12.2 Clock Requirements and Characteristics
        1. Table 5-8  XCLKIN Timing Requirements - PLL Enabled
        2. Table 5-9  XCLKIN Timing Requirements - PLL Disabled
        3. Table 5-10 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    13. 5.13 Flash Timing
      1. Table 5-11 Flash/OTP Endurance for T Temperature Material
      2. Table 5-12 Flash/OTP Endurance for S Temperature Material
      3. Table 5-13 Flash/OTP Endurance for Q Temperature Material
      4. Table 5-14 Flash Parameters at 60-MHz SYSCLKOUT
      5. Table 5-15 Flash/OTP Access Timing
      6. Table 5-16 Flash Data Retention Duration
  6. 6Detailed Description
    1. 6.1 Overview
      1. 6.1.1  CPU
      2. 6.1.2  Control Law Accelerator
      3. 6.1.3  Memory Bus (Harvard Bus Architecture)
      4. 6.1.4  Peripheral Bus
      5. 6.1.5  Real-Time JTAG and Analysis
      6. 6.1.6  Flash
      7. 6.1.7  M0, M1 SARAMs
      8. 6.1.8  L0 SARAM, and L1, L2, and L3 DPSARAMs
      9. 6.1.9  Boot ROM
        1. 6.1.9.1 Emulation Boot
        2. 6.1.9.2 GetMode
        3. 6.1.9.3 Peripheral Pins Used by the Bootloader
      10. 6.1.10 Security
      11. 6.1.11 Peripheral Interrupt Expansion Block
      12. 6.1.12 External Interrupts (XINT1 to XINT3)
      13. 6.1.13 Internal Zero-Pin Oscillators, Oscillator, and PLL
      14. 6.1.14 Watchdog
      15. 6.1.15 Peripheral Clocking
      16. 6.1.16 Low-power Modes
      17. 6.1.17 Peripheral Frames 0, 1, 2, 3 (PFn)
      18. 6.1.18 General-Purpose Input/Output Multiplexer
      19. 6.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 6.1.20 Control Peripherals
      21. 6.1.21 Serial Port Peripherals
    2. 6.2 Memory Maps
    3. 6.3 Register Map
    4. 6.4 Device Emulation Registers
    5. 6.5 VREG, BOR, POR
      1. 6.5.1 On-chip VREG
        1. 6.5.1.1 Using the On-chip VREG
        2. 6.5.1.2 Disabling the On-chip VREG
      2. 6.5.2 On-chip Power-On Reset and Brownout Reset Circuit
    6. 6.6 System Control
      1. 6.6.1 Internal Zero-Pin Oscillators
      2. 6.6.2 Crystal Oscillator Option
      3. 6.6.3 PLL-Based Clock Module
      4. 6.6.4 Loss of Input Clock (NMI-watchdog Function)
      5. 6.6.5 CPU-watchdog Module
    7. 6.7 Low-power Modes Block
    8. 6.8 Interrupts
      1. 6.8.1 External Interrupts
        1. 6.8.1.1 External Interrupt Electrical Data/Timing
          1. Table 6-26 External Interrupt Timing Requirements
          2. Table 6-27 External Interrupt Switching Characteristics
    9. 6.9 Peripherals
      1. 6.9.1  Control Law Accelerator
        1. 6.9.1.1 CLA Device-Specific Information
        2. 6.9.1.2 CLA Register Descriptions
      2. 6.9.2  Analog Block
        1. 6.9.2.1 Analog-to-Digital Converter
          1. 6.9.2.1.1 ADC Device-Specific Information
          2. 6.9.2.1.2 ADC Electrical Data/Timing
            1. Table 6-32  ADC Electrical Characteristics
            2. Table 6-34  ADC Power Modes
            3. 6.9.2.1.2.1 External ADC Start-of-Conversion Electrical Data/Timing
              1. Table 6-35 External ADC Start-of-Conversion Switching Characteristics
            4. 6.9.2.1.2.2 Internal Temperature Sensor
              1. Table 6-36 Temperature Sensor Coefficient
            5. 6.9.2.1.2.3 ADC Power-Up Control Bit Timing
              1. Table 6-37 ADC Power-Up Delays
            6. 6.9.2.1.2.4 ADC Sequential and Simultaneous Timings
        2. 6.9.2.2 Analog Front End
          1. 6.9.2.2.1 AFE Device-Specific Information
          2. 6.9.2.2.2 AFE Register Descriptions
          3. 6.9.2.2.3 PGA Electrical Data/Timing
          4. 6.9.2.2.4 Comparator Block Electrical Data/Timing
            1. Table 6-45 Electrical Characteristics of the Comparator/DAC
          5. 6.9.2.2.5 VREFOUT Buffered DAC Electrical Data
            1. Table 6-46 Electrical Characteristics of VREFOUT Buffered DAC
      3. 6.9.3  Detailed Descriptions
      4. 6.9.4  Serial Peripheral Interface
        1. 6.9.4.1 SPI Device-Specific Information
        2. 6.9.4.2 SPI Register Descriptions
        3. 6.9.4.3 SPI Master Mode Electrical Data/Timing
          1. Table 6-48 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 6-49 SPI Master Mode External Timing (Clock Phase = 1)
        4. 6.9.4.4 SPI Slave Mode Electrical Data/Timing
          1. Table 6-50 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 6-51 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 6.9.5  Serial Communications Interface
        1. 6.9.5.1 SCI Device-Specific Information
        2. 6.9.5.2 SCI Register Descriptions
      6. 6.9.6  Enhanced Controller Area Network
        1. 6.9.6.1 eCAN Device-Specific Information
        2. 6.9.6.2 eCAN Register Descriptions
      7. 6.9.7  Inter-Integrated Circuit
        1. 6.9.7.1 I2C Device-Specific Information
        2. 6.9.7.2 I2C Register Descriptions
        3. 6.9.7.3 I2C Electrical Data/Timing
          1. Table 6-58 I2C Timing Requirements
          2. Table 6-59 I2C Switching Characteristics
      8. 6.9.8  Enhanced Pulse Width Modulator
        1. 6.9.8.1 ePWM Device-Specific Information
        2. 6.9.8.2 ePWM Register Descriptions
        3. 6.9.8.3 ePWM Electrical Data/Timing
          1. Table 6-62 ePWM Timing Requirements
          2. Table 6-63 ePWM Switching Characteristics
          3. 6.9.8.3.1  Trip-Zone Input Timing
            1. Table 6-64 Trip-Zone Input Timing Requirements
      9. 6.9.9  Enhanced Capture Module
        1. 6.9.9.1 eCAP Module Device-Specific Information
        2. 6.9.9.2 eCAP Module Register Descriptions
        3. 6.9.9.3 eCAP Module Electrical Data/Timing
          1. Table 6-66 eCAP Timing Requirement
          2. Table 6-67 eCAP Switching Characteristics
      10. 6.9.10 Enhanced Quadrature Encoder Pulse
        1. 6.9.10.1 eQEP Device-Specific Information
        2. 6.9.10.2 eQEP Register Descriptions
        3. 6.9.10.3 eQEP Electrical Data/Timing
          1. Table 6-69 eQEP Timing Requirements
          2. Table 6-70 eQEP Switching Characteristics
      11. 6.9.11 JTAG Port
        1. 6.9.11.1 JTAG Port Device-Specific Information
      12. 6.9.12 General-Purpose Input/Output
        1. 6.9.12.1 GPIO Device-Specific Information
        2. 6.9.12.2 GPIO Register Descriptions
        3. 6.9.12.3 GPIO Electrical Data/Timing
          1. 6.9.12.3.1 GPIO - Output Timing
            1. Table 6-74 General-Purpose Output Switching Characteristics
          2. 6.9.12.3.2 GPIO - Input Timing
            1. Table 6-75 General-Purpose Input Timing Requirements
          3. 6.9.12.3.3 Sampling Window Width for Input Signals
          4. 6.9.12.3.4 Low-Power Mode Wakeup Timing
            1. Table 6-76 IDLE Mode Timing Requirements
            2. Table 6-77 IDLE Mode Switching Characteristics
            3. Table 6-78 STANDBY Mode Timing Requirements
            4. Table 6-79 STANDBY Mode Switching Characteristics
            5. Table 6-80 HALT Mode Timing Requirements
            6. Table 6-81 HALT Mode Switching Characteristics
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Community Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

CLA Device-Specific Information

The CLA extends the capabilities of the C28x CPU by adding parallel processing. Time-critical control loops serviced by the CLA can achieve low ADC sample to output delay. Thus, the CLA enables faster system response and higher frequency control loops. Using the CLA for time-critical tasks frees up the main CPU to perform other system and communication functions concurently. The following is a list of major features of the CLA.

  • Clocked at the same rate as the main CPU (SYSCLKOUT).
  • An independent architecture allowing CLA algorithm execution independent of the main C28x CPU.
    • Complete bus architecture:
      • Program address bus and program data bus
      • Data address bus, data read bus, and data write bus
    • Independent eight-stage pipeline.
    • 12-bit program counter (MPC)
    • Four 32-bit result registers (MR0–MR3)
    • Two 16-bit auxillary registers (MAR0, MAR1)
    • Status register (MSTF)
  • Instruction set includes:
    • IEEE single-precision (32-bit) floating-point math operations
    • Floating-point math with parallel load or store
    • Floating-point multiply with parallel add or subtract
    • 1/X and 1/sqrt(X) estimations
    • Data type conversions.
    • Conditional branch and call
    • Data load and store operations
  • The CLA program code can consist of up to eight tasks or ISRs.
    • The start address of each task is specified by the MVECT registers.
    • No limit on task size as long as the tasks fit within the CLA program memory space.
    • One task is serviced at a time through to completion. There is no nesting of tasks.
    • Upon task completion, a task-specific interrupt is flagged within the PIE.
    • When a task finishes, the next highest-priority pending task is automatically started.
  • Task trigger mechanisms:
    • C28x CPU through the IACK instruction
    • Task1 to Task7: the corresponding ADC, ePWM, eQEP, or eCAP module interrupt. For example:
      • Task1: ADCINT1 or EPWM1_INT
      • Task2: ADCINT2 or EPWM2_INT
      • Task4: ADCINT4 or EPWM4_INT or EQEPx_INT or ECAPx_INT
      • Task7: ADCINT7 or EPWM7_INT or EQEPx_INT or ECAPx_INT
    • Task8: ADCINT8 or by CPU Timer 0 or EQEPx_INT or ECAPx_INT
  • Memory and Shared Peripherals:
    • Two dedicated message RAMs for communication between the CLA and the main CPU.
    • The C28x CPU can map CLA program and data memory to the main CPU space or CLA space.
    • The CLA has direct access to the CLA Data ROM that stores the math tables required by the routines in the CLA Math Library.
    • The CLA has direct access to the ADC Result registers, comparator and DAC registers, eCAP, eQEP, and ePWM registers.

TMS320F28055 TMS320F28054 TMS320F28053 TMS320F28052 TMS320F28051 TMS320F28050 fbd_cla_prs797.gifFigure 6-15 CLA Block Diagram