SCBS879A May   2012  – January 2020 TMS37145

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Wedge Package
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Operating Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Getting Started
    2. 6.2 Device Nomenclature
    3. 6.3 Documentation Support
    4. 6.4 Support Resources
    5. 6.5 Trademarks
    6. 6.6 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1.     Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of devices. Each device has one of three prefixes: X, P, or null (no prefix) (for example, TMS37145).

Device development evolutionary flow:

X – Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.

P – Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.

null – Production version of the silicon die that is fully qualified.

X and P devices are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.