SCDS389C August   2018  – December 2018 TMUX1208 , TMUX1209

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Application Example
      2.      TMUX1208, TMUX1209 Block Diagram
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions TMUX1208
    2.     Pin Functions TMUX1209
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics (VDD = 5 V ±10 %)
    6. 7.6 Electrical Characteristics (VDD = 3.3 V ±10 %)
    7. 7.7 Electrical Characteristics (VDD = 1.8 V ±10 %)
    8. 7.8 Electrical Characteristics (VDD = 1.2 V ±10 %)
    9. 7.9 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1  On-Resistance
      2. 8.1.2  Off-Leakage Current
      3. 8.1.3  On-Leakage Current
      4. 8.1.4  Transition Time
      5. 8.1.5  Break-Before-Make
      6. 8.1.6  tON(EN) and tOFF(EN)
      7. 8.1.7  Charge Injection
      8. 8.1.8  Off Isolation
      9. 8.1.9  Crosstalk
      10. 8.1.10 Bandwidth
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail to Rail Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Fail-Safe Logic
      5. 8.3.5 Device Functional Modes
      6. 8.3.6 Truth Tables
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Design Requirements
    4. 9.4 Detailed Design Procedure
    5. 9.5 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layout Information
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

TMUX1208: PW Package
16-Pin TSSOP
Top View
TMUX1208 TMUX1209 PW-1208-Pinout.gif
TMUX1208: RSV Package
16-Pin QFN
Top View
TMUX1208 TMUX1209 RSV-1208-Pinout.gif

Pin Functions TMUX1208

PIN TYPE(1) DESCRIPTION
NAME TSSOP UQFN
A0 1 15 I Address line 0. Controls the switch configuration as shown in Table 1.
EN 2 16 I Active high logic input. When this pin is low, all switches are turned off. When this pin is high, the A[2:0] address inputs determine which switch is turned on.
N.C. 3 1 Not Connected Not Connected
S1 4 2 I/O Source pin 1. Can be an input or output.
S2 5 3 I/O Source pin 2. Can be an input or output.
S3 6 4 I/O Source pin 3. Can be an input or output.
S4 7 5 I/O Source pin 4. Can be an input or output.
D 8 6 I/O Drain pin. Can be an input or output.
S8 9 7 I/O Source pin 8. Can be an input or output.
S7 10 8 I/O Source pin 7. Can be an input or output.
S6 11 9 I/O Source pin 6. Can be an input or output.
S5 12 10 I/O Source pin 5. Can be an input or output.
VDD 13 11 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
GND 14 12 P Ground (0 V) reference
A2 15 13 I Address line 2. Controls the switch configuration as shown in Table 1.
A1 16 14 I Address line 1. Controls the switch configuration as shown in Table 1.
I = input, O = output, I/O = input and output, P = power
TMUX1209: PW Package
16-Pin TSSOP
Top View
TMUX1209: RSV Package
16-Pin QFN
Top View

Pin Functions TMUX1209

PIN TYPE(1) DESCRIPTION
NAME TSSOP UQFN
A0 1 15 I Address line 0. Controls the switch configuration as shown in Table 2.
EN 2 16 I Active high logic input. When this pin is low, all switches are turned off. When this pin is high, the A[1:0] address inputs determine which switch is turned on.
N.C. 3 1 Not Connected Not Connected
S1A 4 2 I/O Source pin 1A. Can be an input or output.
S2A 5 3 I/O Source pin 2A. Can be an input or output.
S3A 6 4 I/O Source pin 3A. Can be an input or output.
S4A 7 5 I/O Source pin 4A. Can be an input or output.
DA 8 6 I/O Drain pin A. Can be an input or output.
DB 9 7 I/O Drain pin B. Can be an input or output.
S4B 10 8 I/O Source pin 4B. Can be an input or output.
S3B 11 9 I/O Source pin 3B. Can be an input or output.
S2B 12 10 I/O Source pin 2B. Can be an input or output.
S1B 13 11 I/O Source pin 1B. Can be an input or output.
VDD 14 12 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
GND 15 13 P Ground (0 V) reference
A1 16 14 I Address line 1. Controls the switch configuration as shown in Table 2.
I = input, O = output, I/O = input and output, P = power