SLOS907C April   2015  – December 2017 TPA3144D2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Gain Setting via GAIN Pin
      2. 9.3.2  SD Operation
      3. 9.3.3  Gain Limit Control, LIMTHRES and LIMRATE
      4. 9.3.4  SPEAKERGUARD Automatic Gain Limit, AGL
      5. 9.3.5  Thermal Foldback, TFB
      6. 9.3.6  PLIMIT
      7. 9.3.7  LIMTHRES
      8. 9.3.8  Spread Spectrum and De-Phase Control
      9. 9.3.9  GVDD Supply
      10. 9.3.10 DC Detect
      11. 9.3.11 PBTL Select
      12. 9.3.12 Short-Circuit Protection and Automatic Recovery Feature
      13. 9.3.13 Thermal Protection
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 PCB Material Recommendation
        2. 10.2.1.2 PVCC Capacitor Recommendation
        3. 10.2.1.3 Decoupling Capacitor Recommendations
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Ferrite Bead Filter Considerations
        2. 10.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
        3. 10.2.2.3 When to Use an Output Filter for EMI Suppression
        4. 10.2.2.4 Input Resistance
        5. 10.2.2.5 Input Capacitor, Ci
        6. 10.2.2.6 BSN and BSP Capacitors
        7. 10.2.2.7 Differential Inputs
        8. 10.2.2.8 Using Low-ESR Capacitors
      3. 10.2.3 Application Performance Curves
        1. 10.2.3.1 EN55013 Radiated Emissions Results
        2. 10.2.3.2 EN55022 Conducted Emissions Results
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling, CS
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TPA3144D2 is an efficient, Class-D audio power amplifier for driving bridged-tied stereo speakers at up to 6 W, 6 Ω, or 8 Ω (per channel).

Advanced EMI Suppression Technology with Spread Spectrum Control and 1SPW modulation scheme enables the use of inexpensive ferrite bead filters at the outputs while meeting EMC requirements for system cost reduction. TPA3144D2 is not only fully protected against shorts and overload, the SpeakerGuard™ speaker protection circuitry includes an adjustable Automatic Gain Limit (AGL), an adjustable power limiter and a DC detection circuit for protection of the connected speakers. The AGL allows adjustment of the maximum output voltage without signal clipping for enhanced speaker protection and audio quality. The DC detect and Pin-to-Pin, Pin-to-Ground, and Pin-to-Power Short Circuit protection circuit protect the speakers from output DC and pin shorts caused in production. The outputs are also fully protected against shorts to GND, PVCC, and output-to-output. The short-circuit protection and thermal protection includes an auto recovery feature.

The TPA3144D2 can drive stereo speakers with as low as 4-Ω impedance. The high efficiency of the TPA3144D2, 90% with an 8-Ω load, eliminates the need for an external heat sink, and TPA3144D2 will be able to output full power on a 2-layer PCB.

Device Information(1)

PART NUMBERPACKAGEBODY SIZE (NOM)
TPA3144D2 HTSSOP (28) 9.70 mm × 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.