SLLSEJ9E December   2014  – October 2022 TPD2E2U06-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—AEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 ESD Ratings—ISO Specification
    5. 6.5 Recommended Operating Conditions
    6. 6.6 Thermal Information
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 AEC-Q101 Qualified
      2. 7.3.2 IEC 61000-4-2 Level 4
      3. 7.3.3 IO Capacitance
      4. 7.3.4 DC Breakdown Voltage
      5. 7.3.5 Ultra-Low Leakage Current
      6. 7.3.6 Low ESD Clamping Voltage
      7. 7.3.7 Industrial Temperature Range
      8. 7.3.8 Small Easy-to-Route Packages
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Signal Range
        2. 8.2.2.2 Operating Frequency
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (May 2016) to Revision E (October 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the Surge Curve (tp = 8/20 μs) IO to GND figureGo

Changes from Revision C (March 2016) to Revision D (May 2016)

  • Updated Features, Applications, and Description Go
  • Updated the ESD Ratings—AEC Specification table Go

Changes from Revision B (December 2014) to Revision C (March 2016)

  • Added DCK packageGo
  • Added DCK thermal data in the Thermal Information tableGo

Changes from Revision A (December 2014) to Revision B (December 2014)

  • Added temperature specification to VBR TEST CONDITIONS. Go

Changes from Revision * (December 2014) to Revision A (December 2014)

  • Initial release of full document. Go