SLVSDO6C August   2017  – June 2019 TPS1H000-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Block Diagram
      2.      Current-Limit Protection in Auto-Retry Mode
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 DELAY Pin Configuration
        1. 7.3.2.1 Holding Mode
        2. 7.3.2.2 Latch-Off Mode
        3. 7.3.2.3 Auto-Retry Mode
      3. 7.3.3 Standalone Operation
      4. 7.3.4 Fault Truth Table
      5. 7.3.5 Full Diagnostics
        1. 7.3.5.1 Short-to-GND and Overload Detection
        2. 7.3.5.2 Open-Load Detection
          1. 7.3.5.2.1 Output On
          2. 7.3.5.2.2 Output Off
        3. 7.3.5.3 Short-to-Battery Detection
        4. 7.3.5.4 Thermal Fault Detection
          1. 7.3.5.4.1 Thermal Shutdown
          2. 7.3.5.4.2 Thermal Swing
          3. 7.3.5.4.3 Fault Report Holding
      6. 7.3.6 Full Protections
        1. 7.3.6.1 UVLO Protection
        2. 7.3.6.2 Inductive Load Switching Off Clamp
        3. 7.3.6.3 Loss-of-GND Protection
        4. 7.3.6.4 Loss-of-Power-Supply Protection
        5. 7.3.6.5 Reverse-Current Protection
        6. 7.3.6.6 MCU I/O Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Working Modes
        1. 7.4.1.1 Normal Mode
        2. 7.4.1.2 Standby Mode
        3. 7.4.1.3 Standby Mode With Diagnostics
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply voltage VS pin t < 400 ms 42 V
Reverse polarity voltage (3) t < 1 minute –36 V
Current on GND t < 2 minutes –100 250 mA
Voltage on IN and DIAG_EN pins –0.3 VS V
Current on IN and DIAG_EN pins –10 mA
Voltage on DELAY pin –0.3 7 V
Current on DELAY pin –60 mA
Voltage on FAULT pin –0.3 7 V
Current on FAULT pin –30 10 mA
Voltage on CL pin –0.3 7 V
Current on CL pin 6 mA
Voltage on OUT pin 42 V
Inductive load switch-off energy dissipation single pulse(4) 40 mJ
Operating junction temperature –40 150 °C
Storage temperature, Tstg –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to ground.
Reverse polarity condition: VIN = 0 V, reverse current < IR(2), GND pin 1-kΩ resistor in parallel with diode.
Test condition: VVS = 13.5 V, L = 300 mH, TJ = 150°C. FR4 2s2p board, 2 × 70-μm Cu, 2 × 35-μm Cu. 600 mm2 thermal pad copper area.