SLVS490J december   2003  – august 2023 TPS2061 , TPS2062 , TPS2063 , TPS2065 , TPS2066 , TPS2067

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Dissipating Rating Table
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Typical Characteristics(All Devices Excluding TPS2065DBV)
    6. 7.6 Typical Characteristics (TPS2065DBV)
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1  Functional Block Diagram
    2. 9.2  Power Switch
    3. 9.3  Charge Pump
    4. 9.4  Driver
    5. 9.5  Enable ( ENx or ENx)
    6. 9.6  Current Sense
    7. 9.7  Overcurrent
      1. 9.7.1 Overcurrent Conditions (All Devices Excluding TPS2065DBV)
      2. 9.7.2 Overcurrent Conditions (TPS2065DBV)
    8. 9.8  Overcurrent ( OCx)
    9. 9.9  Thermal Sense
    10. 9.10 Undervoltage Lockout
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1  Power-supply Considerations
      2. 10.1.2  OC Response
      3. 10.1.3  Power Dissipation and Junction Temperature
      4. 10.1.4  Thermal Protection
      5. 10.1.5  Undervoltage Lockout (UVLO)
      6. 10.1.6  Universal Serial Bus (USB) Applications
      7. 10.1.7  Host/Self-Powered and Bus-powered Hubs
      8. 10.1.8  Low-power Bus-powered and High-Power Bus-Powered Functions
      9. 10.1.9  USB Power-distribution Requirements
      10. 10.1.10 Generic Hot-Plug Applications
  12. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Documentation Support
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.