SLVSC42A August   2013  – April 2015 TPS22967

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VBIAS = 5 V
    6. 7.6 Electrical Characteristics: VBIAS = 2.5 V
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
      1. 7.8.1 Typical AC Scope Captures at TA = 25ºC, CT = 1 nF
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 ON/OFF Control
      2. 8.3.2 Adjustable Rise Time
      3. 8.3.3 Quick Output Discharge
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor (Optional)
      2. 9.1.2 Output Capacitor (Optional)
      3. 9.1.3 VIN and VBIAS Voltage Range
      4. 9.1.4 Safe Operating Area (SOA)
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inrush Current
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT(2)
VIN Input voltage –0.3 6 V
VOUT Output voltage –0.3 6 V
VBIAS Bias voltage –0.3 6 V
VON ON voltage –0.3 6 V
IMAX Maximum continuous switch current 4 A
IPLS Maximum pulsed switch current, pulse <300 µs, 2% duty cycle 6 A
TA Operating free-air temperature(3) –40 85 °C
TJ Maximum junction temperature 125 °C
TLEAD Maximum lead temperature (10-s soldering time) 300 °C
TSTG Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)).

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Input voltage 0.8 VBIAS V
VBIAS Bias voltage 2.5 5.5 V
VON ON voltage 0 5.5 V
VOUT Output voltage VIN V
VIH High-level input voltage, ON VBIAS = 2.5 V to 5.5 V 1.2 5.5 V
VIL Low-level input voltage, ON VBIAS = 2.5 V to 5.5 V 0 0.5 V
CIN Input capacitor 1(1) µF

7.4 Thermal Information

THERMAL METRIC(1) TPS22967 UNIT
DSG [WSON]
8 PINS
RθJA Junction-to-ambient thermal resistance 65.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 74.2
RθJB Junction-to-board thermal resistance 35.4
ψJT Junction-to-top characterization parameter 2.2
ψJB Junction-to-board characterization parameter 36
RθJC(bot) Junction-to-case (bottom) thermal resistance 12.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics: VBIAS = 5 V

Unless otherwise noted, the specification in the following table applies over the operating ambient temperature –40°C ≤ TA ≤ 85°C (Full) and VBIAS = 5 V. Typical values are for TA = 25°C.
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
IIN(VBIAS-ON) VBIAS quiescent current IOUT = 0,
VIN = VON = VBIAS = 5 V		 Full 50 75 µA
IIN(VBIAS-OFF) VBIAS shutdown current VON = GND, VOUT = 0 V Full 2 µA
IIN(VIN-OFF) VIN off-state supply current VON = GND,
VOUT = 0 V		 VIN = 5 V Full 0.2 8 µA
VIN = 3.3 V 0.02 3
VIN = 1.8 V 0.01 2
VIN = 0.8 V 0.005 1
ION ON pin input leakage current VON = 5.5 V Full 0.5 µA
RESISTANCE CHARACTERISTICS
RON ON-state resistance IOUT = –200 mA,
VBIAS = 5 V		 VIN = 5 V 25°C 22 33 mΩ
Full 35
VIN = 3.3 V 25°C 22 33
Full 35
VIN = 1.8 V 25°C 22 33
Full 35
VIN = 1.5 V 25°C 22 33
Full 35
VIN = 1.2 V 25°C 22 33
Full 35
VIN = 0.8 V 25°C 22 33
Full 35
RPD Output pulldown resistance VIN = 5.0 V, VON = 0V, IOUT = 15 mA Full 225 300 Ω

7.6 Electrical Characteristics: VBIAS = 2.5 V

Unless otherwise noted, the specification in the following table applies over the operating ambient temperature –40°C ≤ TA ≤ 85°C (Full) and VBIAS = 2.5 V. Typical values are for TA = 25°C.
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
IIN(VBIAS-ON) VBIAS quiescent current IOUT = 0,
VIN = VON = VBIAS = 2.5 V		 Full 20 30 µA
IIN(VBIAS-OFF) VBIAS shutdown current VON = GND, VOUT = 0 V Full 2 µA
IIN(VIN-OFF) VIN off-state supply current VON = GND,
VOUT = 0 V		 VIN = 2.5 V Full 0.01 3 µA
VIN = 1.8 V 0.01 2
VIN = 1.2 V 0.005 2
VIN = 0.8 V 0.003 1
ION ON pin input leakage current VON = 5.5 V Full 0.5 µA
RESISTANCE CHARACTERISTICS
RON ON-state resistance IOUT = –200 mA,
VBIAS = 2.5 V		 VIN = 2.5 V 25°C 26 38 mΩ
Full 40
VIN = 1.8 V 25°C 26 38
Full 40
VIN = 1.5 V 25°C 25 38
Full 40
VIN = 1.2 V 25°C 24 38
Full 40
VIN = 0.8 V 25°C 24 38
Full 40
RPD Output pulldown resistance VIN = 2.5 V, VON = 0 V, IOUT = 1 mA Full 275 325 Ω

7.7 Switching Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN = VON = VBIAS = 5 V, TA = 25ºC (UNLESS OTHERWISE NOTED)
tON Turnon time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 1325 µs
tOFF Turnoff time 10
tR VOUT rise time 1625
tF VOUT fall time 3.5
tD ON delay time 500
VIN = 0.8 V, VON = VBIAS = 5 V, TA = 25ºC (UNLESS OTHERWISE NOTED)
tON Turnon time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 600 µs
tOFF Turnoff time 80
tR VOUT rise time 300
tF VOUT fall time 5.5
tD ON delay time 460
VIN = 2.5 V, VON = 5 V, VBIAS = 2.5 V, TA = 25ºC (UNLESS OTHERWISE NOTED)
tON Turnon time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 2200 µs
tOFF Turnoff time 9
tR VOUT rise time 2275
tF VOUT fall time 3.1
tD ON delay time 1075
VIN = 0.8 V, VON = 5 V, VBIAS = 2.5 V, TA = 25ºC (UNLESS OTHERWISE NOTED)
tON Turn-on time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 1450 µs
tOFF Turn-off time 60
tR VOUT rise time 875
tF VOUT fall time 5.5
tD ON delay time 1010
TPS22967 tst_cir_lvsc42.gifFigure 1. Test Circuit and Timing Waveforms

7.8 Typical Characteristics

TPS22967 G001_lvsbj0.gifFigure 2. VBIAS vs Quiescent Current
TPS22967 G003_lvsbj0.gifFigure 4. VIN vs Off-State VIN Current
TPS22967 G005_lvsc42.pngFigure 6. Temperature vs RON (VBIAS = 5.5 V)
TPS22967 G007_lvsc42.pngFigure 8. VIN vs RON (VBIAS = 5.5 V)
TPS22967 G009_lvsbj0.gifFigure 10. VIN vs RPD (VBIAS = 5.5 V)
TPS22967 G011_lvsbj0.gifFigure 12. VIN vs tD (VBIAS = 2.5 V, CT = 1 nF)
TPS22967 G013_lvsbj0.gifFigure 14. VIN vs tF (VBIAS = 2.5 V, CT = 1 nF)
TPS22967 G015_lvsbj0.gifFigure 16. VIN vs tOFF (VBIAS = 2.5 V, CT = 1 nF)
TPS22967 G017_lvsbj0.gifFigure 18. VIN vs tON (VBIAS = 2.5 V, CT = 1 nF)
TPS22967 G019_lvsbj0.gifFigure 20. VIN vs tR (VBIAS = 2.5 V, CT = 1 nF)
TPS22967 G021_lvsbj0.gifFigure 22. VBIAS vs tR (VIN = 2.5 V, CT = 1 nF)
TPS22967 G002_lvsbj0.gifFigure 3. VBIAS vs Shutdown Current
TPS22967 G004_lvsc42.pngFigure 5. Temperature vs RON (VBIAS = 2.5 V)
TPS22967 G006_lvsc42.pngFigure 7. VIN vs RON (VBIAS = 2.5 V)
TPS22967 G008b_lvsc42.gifFigure 9. VIN vs RON (TA = 25°C)
TPS22967 G010_lvsbj0.gifFigure 11. VON vs VOUT (TA = 25°C)
TPS22967 G012_lvsbj0.gifFigure 13. VIN vs tD (VBIAS = 5.5 V, CT = 1 nF)
TPS22967 G014_lvsbj0.gifFigure 15. VIN vs tF (VBIAS = 5.5 V, CT = 1 nF)
TPS22967 G016_lvsbj0.gifFigure 17. VIN vs tOFF (VBIAS = 5.5 V, CT = 1 nF)
TPS22967 G018_lvsbj0.gifFigure 19. VIN vs tON (VBIAS = 5.5 V, CT = 1 nF)
TPS22967 G020_lvsbj0.gifFigure 21. VIN vs tR (VBIAS = 5.5 V, CT = 1 nF)

7.8.1 Typical AC Scope Captures at TA = 25ºC, CT = 1 nF

TPS22967 sc001_lvsbj0.pngFigure 23. Turnon Response Time
(VIN = 0.8 V, VBIAS = 2.5 V, CIN = 1 µF, CL = 0.1 µF,
RL = 10 Ω)
CH1: VOUT, CH2: ON
TPS22967 sc003_lvsbj0.pngFigure 25. Turnon Response Time
(VIN = 2.5 V, VBIAS = 2.5 V, CIN = 1 µF, CL = 0.1 µF,
RL = 10 Ω)
CH1: VOUT, CH2: ON
TPS22967 sc005_lvsbj0.pngFigure 27. Turnoff Response Time
(VIN = 0.8 V, VBIAS = 2.5 V, CIN = 1 µF, CL = 0.1 µF,
RL = 10 Ω)
CH1: VOUT, CH2: ON
TPS22967 sc007_lvsbj0.pngFigure 29. Turnoff Response Time
(VIN = 2.5 V, VBIAS = 2.5 V, CIN = 1 µF, CL = 0.1 µF,
RL = 10 Ω)
CH1: VOUT, CH2: ON
TPS22967 sc002_lvsbj0.pngFigure 24. Turnon Response Time
(VIN = 0.8 V, VBIAS = 5 V, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω)
CH1: VOUT, CH2: ON
TPS22967 tst_lvsbj0.pngFigure 26. Turnon Response Time
(VIN = 5 V, VBIAS = 5 V, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω)
CH1: VOUT, CH2: ON
TPS22967 sc006_lvsbj0.pngFigure 28. Turnoff Response Time
(VIN = 0.8 V, VBIAS = 5 V, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω)
CH1: VOUT, CH2: ON
TPS22967 sc008_lvsbj0.pngFigure 30. Turnoff Response Time
(VIN = 5 V, VBIAS = 5 V, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω)
CH1: VOUT, CH2: ON