SLVSCP7B November   2014  – March 2016 TPS22968-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics (VBIAS = 5 V)
    6. 7.6 Electrical Characteristics (VBIAS = 3.3 V)
    7. 7.7 Electrical Characteristics (VBIAS = 2.5 V)
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
      1. 7.9.1 DC Characteristics
      2. 7.9.2 AC Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ON and OFF Control
      2. 9.3.2 Quick Output Discharge (QOD) (TPS22968-Q1 Only)
      3. 9.3.3 Adjustable Rise Time
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Capacitor (Optional)
      2. 10.1.2 Output Capacitor (Optional)
      3. 10.1.3 VIN and VBIAS Voltage Range
        1. 10.1.3.1 Parallel Configuration
        2. 10.1.3.2 Standby Power Reduction
        3. 10.1.3.3 Power Supply Sequencing Without a GPIO Input
        4. 10.1.3.4 Reverse Current Blocking
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Inrush Current
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Developmental Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature (unless otherwise noted) (1) (2)
MIN MAX UNIT
VIN1,2 Input voltage –0.3 6 V
VBIAS Bias voltage –0.3 6 V
VOUT1,2 Output voltage –0.3 6 V
VON1,2 ON voltage –0.3 6 V
IMAX Maximum continuous switch current per channel, TA = 50 °C 4 A
IPLS Maximum pulsed switch current, pulse <300 µs, 2% duty cycle 6 A
TJ Maximum junction temperature 150 °C
TLEAD Maximum lead temperature (10-s soldering time) 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

MIN MAX UNIT
VIN1,2 Input voltage range 0.8 VBIAS V
VBIAS Bias voltage range 2.5 5.5 V
VON1,2 ON voltage range 0 5.5 V
VOUT1,2 Output voltage range VIN V
VIH, ON1,2 High-level input voltage, ON1,2 VBIAS = 2.5 to 5.5 V 1.2 5.5 V
VIL, ON1,2 Low-level input voltage, ON1,2 VBIAS = 2.5 to 5.5 V 0 0.5 V
CIN1,2 Input capacitor 1 (1) µF
TA Operating free-air temperature (2) –40 125 °C
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA(max) = TJ(max) – (RθJA × PD(max)).

7.4 Thermal Information

THERMAL METRIC (1) (2) TPS22968x-Q1 UNIT
DMG (WSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 55.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 71 °C/W
RθJB Junction-to-board thermal resistance 21.7 °C/W
ψJT Junction-to-top characterization parameter 1.9 °C/W
ψJB Junction-to-board characterization parameter 21.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

7.5 Electrical Characteristics (VBIAS = 5 V)

VBIAS = 5 V. Typical values are for TA = 25°C, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
IQ, VBIAS VBIAS quiescent current (both channels) IOUT1 = IOUT2 = 0 A,
VIN1,2 = VON1,2 = VBIAS = 5 V
–40°C to +85°C 58 70 µA
–40°C to +125°C 70
VBIAS quiescent current (single channel) IOUT1 = IOUT2 = 0 A,
VON2 = 0 V, VIN1,2 = VON1 = VBIAS = 5 V
–40°C to +85°C 58 68 µA
–40°C to +125°C 68
ISD, VBIAS VBIAS shutdown current VON1,2 = 0 V, VOUT1,2 = 0 V –40°C to +85°C 1 2 µA
–40°C to +125°C 2
ISD, VIN1,2 VIN1,2 shutdown current (per channel) VON1,2 = 0 V,
VOUT1,2 = 0 V
VIN1,2 = 5 V –40°C to +85°C 0.5 8 µA
–40°C to +125°C 36
VIN1,2 = 3.3 V –40°C to +85°C 0.1 3
–40°C to +125°C 13
VIN1,2 = 1.8 V –40°C to +85°C 0.07 2
–40°C to +125°C 6
VIN1,2 = 1.2 V –40°C to +85°C 0.05 1
–40°C to +125°C 4
VIN1,2 = 0.8 V –40°C to +85°C 0.04 1
–40°C to +125°C 4
ION1,2 ON pin input leakage current VON = 5.5 V –40°C to +125°C 0.1 µA
RESISTANCE CHARACTERISTICS
RON ON-state resistance IOUT = –200 mA,
VBIAS = 5 V
VIN = 5 V 25°C 29 35
–40°C to +85°C 40
–40°C to +125°C 43
VIN = 3.3 V 25°C 27 32
–40°C to +85°C 36
–40°C to +125°C 40
VIN = 1.8 V 25°C 26 32
–40°C to +85°C 36
–40°C to +125°C 39
VIN = 1.2 V 25°C 26 32
–40°C to +85°C 36
–40°C to +125°C 39
VIN = 0.8 V 25°C 26 32
–40°C to +85°C 36
–40°C to +125°C 39
RPD (1) Output pulldown resistance VIN = 5 V, VON = 0 V, IOUT = 5 mA –40°C to +125°C 270 320 Ω
(1) The TPS22968N-Q1 device does not feature an output pulldown resistance RPD

7.6 Electrical Characteristics (VBIAS = 3.3 V)

VBIAS = 3.3 V. Typical values are for TA = 25°C, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
IQ, VBIAS VBIAS quiescent current (both channels) IOUT1 = IOUT2 = 0 A,
VIN1,2 = VON1,2 = VBIAS = 3.3 V
–40°C to +85°C 27 40 µA
–40°C to +125°C 40
VBIAS quiescent current (single channel) IOUT1 = IOUT2 = 0 A, VON2 = 0 V,
VIN1,2 = VON1 = VBIAS = 3.3 V
–40°C to +85°C 27 40 µA
–40°C to +125°C 40
ISD, VBIAS VBIAS shutdown current VON1,2 = 0 V, VOUT1,2 = 0 V –40°C to +85°C 0.5 1 µA
–40°C to +125°C 1
ISD, VIN1,2 VIN1,2 shutdown current (per channel) VON1,2 = 0 V,
VOUT1,2 = 0 V
VIN1,2 = 3.3 V –40°C to +85°C 0.1 3 µA
–40°C to +125°C 13
VIN1,2 = 1.8 V –40°C to +85°C 0.07 2
–40°C to +125°C 6
VIN1,2 = 1.2 V –40°C to +85°C 0.05 1
–40°C to +125°C 4
VIN1,2 = 0.8 V –40°C to +85°C 0.04 1
–40°C to +125°C 4
ION1,2 ON pin input leakage current VON = 5.5 V –40°C to +125°C 0.1 µA
RESISTANCE CHARACTERISTICS
RON ON-state resistance IOUT = –200 mA,
VBIAS = 3.3 V
VIN = 3.3 V 25°C 32 38
–40°C to +85°C 44
–40°C to +125°C 48
VIN = 1.8 V 25°C 28 33
–40°C to +85°C 38
–40°C to +125°C 42
VIN = 1.2 V 25°C 27 33
–40°C to +85°C 38
–40°C to +125°C 41
VIN = 0.8 V 25°C 27 32
–40°C to +85°C 37
–40°C to +125°C 40
RPD (1) Output pulldown resistance VIN = 3.3 V, VON = 0 V, IOUT = 5 mA –40°C to +125°C 270 320 Ω
(1) The TPS22968N-Q1 device does not feature an output pulldown resistance RPD

7.7 Electrical Characteristics (VBIAS = 2.5 V)

VBIAS = 2.5 V. Typical values are for TA = 25°C, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
IQ, VBIAS VBIAS quiescent current (both channels) IOUT1 = IOUT2 = 0,
VIN1,2 = VON1,2 = VBIAS = 2.5 V
–40°C to 85°C 19 27 µA
–40°C to 125°C 27
VBIAS quiescent current (single channel) IOUT1 = IOUT2 = 0,
VON2 = 0 V, VIN1,2 = VON1 = VBIAS = 2.5 V
–40°C to 85°C 19 27 µA
–40°C to 125°C 27
ISD, VBIAS VBIAS shutdown current VON1,2 = 0 V, VOUT1,2 = 0 V –40°C to 85°C 0.4 1 µA
–40°C to 125°C 1
ISD, VIN1,2 VIN1,2 shutdown current (per channel) VON1,2 = 0 V,
VOUT1,2 = 0 V
VIN1,2 = 2.5 V –40°C to 85°C 0.1 2 µA
–40°C to 125°C 9
VIN1,2 = 1.8 V –40°C to 85°C 0.07 2
–40°C to 125°C 6
VIN1,2 = 1.2 V –40°C to 85°C 0.05 1
–40°C to 125°C 4
VIN1,2 = 0.8 V –40°C to 85°C 0.04 1
–40°C to 125°C 4
ION1,2 ON pin input leakage current VON = 5.5 V –40°C to 125°C 0.1 µA
RESISTANCE CHARACTERISTICS
RON ON-state resistance IOUT = –200 mA,
VBIAS = 2.5 V
VIN = 2.5 V 25°C 39 45
–40°C to 85°C 52
–40°C to 125°C 57
VIN = 1.8 V 25°C 34 39
–40°C to 85°C 46
–40°C to 125°C 50
VIN = 1.2 V 25°C 31 37
–40°C to 85°C 42
–40°C to 125°C 46
VIN = 0.8 V 25°C 30 35
–40°C to 85°C 41
–40°C to 125°C 44
RPD Output pulldown resistance VIN = 2.5 V, VON = 0 V, IOUT = 5 mA –40°C to 125°C 270 320 Ω

7.8 Switching Characteristics

TA = 25 °C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN = VON = VBIAS = 5 V
tON Turn-on time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 1150 µs
tOFF Turn-off time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 4
tR VOUT rise time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 1400
tF VOUT fall time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 2
tD ON delay time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 469
VIN = 0.8 V, VON = VBIAS = 5 V
tON Turn-on time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 514 µs
tOFF Turn-off time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 31
tR VOUT rise time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 271
tF VOUT fall time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 2
tD ON delay time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 382
VIN = 3.3 V, VON = 5 V, VBIAS = 3.3 V
tON Turn-on time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 1455 µs
tOFF Turn-off time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 5
tR VOUT rise time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 1592
tF VOUT fall time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 2
tD ON delay time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 681
VIN = 0.8 V, VON = 5 V, VBIAS = 3.3 V
tON Turn-on time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 805 µs
tOFF Turn-off time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 31
tR VOUT rise time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 455
tF VOUT fall time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 2
tD ON delay time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 577
VIN = 2.5 V, VON = 5 V, VBIAS = 2.5 V
tON Turn-on time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 1800 µs
tOFF Turn-off time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 6
tR VOUT rise time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 1830
tF VOUT fall time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 2
tD ON delay time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 909
VIN = 0.8 V, VON = 5 V, VBIAS = 2.5 V
tON Turn-on time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 1140 µs
tOFF Turn-off time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 28
tR VOUT rise time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 664
tF VOUT fall time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 2
tD ON delay time RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF 798

7.9 Typical Characteristics

7.9.1 DC Characteristics

TPS22968-Q1 C001_SLVSCP7.png
VON = 5 V VOUT = Open
Figure 1. IQ, VBIAS vs VBIAS (Single Channel)
TPS22968-Q1 C004_SLVSCP7.png
VON = 0 V VOUT = 0 V
Figure 3. ISD, VBIAS vs VBIAS
TPS22968-Q1 C007_SLVSCP7.png
IOUT = –200 mA
Figure 5. RON vs Ambient Temperature, VBIAS = 3.3 V
TPS22968-Q1 C010_SLVSCP7.png
IOUT = –200 mA
Figure 7. RON vs VIN, VBIAS = 3.3 V
TPS22968-Q1 C009_SLVSCP7.png
TA = 25°C VBIAS = 5 V
Figure 9. RON vs IOUT
TPS22968-Q1 C016_SLVSCP7.png
VIN = VBIAS VON = 0 V IOUT = 5 mA
Figure 11. RPD vs VBIAS (TPS22968-Q1 Only)
TPS22968-Q1 C002_SLVSCP7.png
VON = 5 V VOUT = Open
Figure 2. IQ, VBIAS vs VBIAS (Dual Channel)
TPS22968-Q1 C005_SLVSCP7.png
VBIAS = 5 V VOUT = 0 V VON = 0 V
Figure 4. ISD, VIN vs VIN (One Channel)
TPS22968-Q1 C008_SLVSCP7.png
IOUT = –200 mA
Figure 6. RON vs Ambient Temperature , VBIAS = 5 V
TPS22968-Q1 C011_SLVSCP7.png
IOUT = –200 mA
Figure 8. RON vs VIN, VBIAS = 5 V
TPS22968-Q1 C015_SLVSCP7.png
TA = 25°C IOUT = –200 mA
Figure 10. RON vs VBIAS
TPS22968-Q1 C017_SLVSCP7.png
TA = 25°C VIN = 2 V
Figure 12. VOUT vs VON

7.9.2 AC Characteristics

CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, CT = 1 nF (unless otherwise specified)
TPS22968-Q1 C018_SLVSCP7.png
Figure 13. tD vs VIN, VBIAS = 3.3 V
TPS22968-Q1 C020_SLVSCP7.png
Figure 15. tF vs VIN, VBIAS = 3.3 V
TPS22968-Q1 C022_SLVSCP7.png
Figure 17. tOFF vs VIN, VBIAS = 3.3 V
TPS22968-Q1 C024_SLVSCP7.png
Figure 19. tON vs VIN, VBIAS = 3.3 V
TPS22968-Q1 C026_SLVSCP7.png
Figure 21. tR vs VIN, VBIAS = 3.3 V
TPS22968-Q1 C028_SLVSCP7.png
VIN = 2.5 V
Figure 23. tR vs VBIAS
TPS22968-Q1 TurnON_VIN0p8V_VBIAS2p5V.png
Figure 25. Turn-On Response Time
(VIN = 0.8 V, VBIAS = 2.5 V)
TPS22968-Q1 TurnON_VIN2p5V_VBIAS2p5V.png
Figure 27. Turn-On Response Time
(VIN = 2.5 V, VBIAS = 2.5 V)
TPS22968-Q1 TurnOFF_VIN0p8V_VBIAS2p5V.png
Figure 29. Turn-Off Response Time
(VIN = 0.8 V, VBIAS = 2.5 V)
TPS22968-Q1 TurnOFF_VIN2p5V_VBIAS2p5V.png
Figure 31. Turn-Off Response Time
(VIN = 2.5 V, VBIAS = 2.5 V)
TPS22968-Q1 C019_SLVSCP7.png
Figure 14. tD vs VIN, VBIAS = 5 V
TPS22968-Q1 C021_SLVSCP7.png
Figure 16. tF vs VIN, VBIAS = 5 V
TPS22968-Q1 C023_SLVSCP7.png
Figure 18. tOFF vs VIN, VBIAS = 5 V
TPS22968-Q1 C025_SLVSCP7.png
Figure 20. tON vs VIN, VBIAS = 5 V
TPS22968-Q1 C027_SLVSCP7.png
Figure 22. tR vs VIN, VBIAS = 5 V
TPS22968-Q1 C029_SLVSCP7.png
VBIAS = 5 V TA = 25°C
Figure 24. tR vs CT
TPS22968-Q1 TurnON_VIN0p8V_VBIAS5V.png
Figure 26. Turn-On Response Time
(VIN = 0.8 V, VBIAS = 5 V)
TPS22968-Q1 TurnON_VIN5V_VBIAS5V.png
Figure 28. Turn-On Response Time
(VIN = 5 V, VBIAS = 5 V)
TPS22968-Q1 TurnOFF_VIN0p8V_VBIAS5V.png
Figure 30. Turn-Off Response Time
(VIN = 0.8 V, VBIAS = 5 V)
TPS22968-Q1 TurnOFF_VIN5V_VBIAS5V.png
Figure 32. Turn-Off Response Time
(VIN = 5 V, VBIAS = 5 V)