SLVSB98A March   2012  – July 2015 TPS2379

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CDB Converter Disable Bar Pin Interface
      2. 8.3.2 CLS Classification
      3. 8.3.3 DEN Detection and Enable
      4. 8.3.4 GATE Auxiliary Gate Driver
        1. 8.3.4.1 External Boost Circuit (Q1, Q2, and RBLST) Considerations
      5. 8.3.5 Internal Pass MOSFET
      6. 8.3.6 T2P Type-2 PSE Indicator
      7. 8.3.7 VDD Supply Voltage
      8. 8.3.8 VSS
      9. 8.3.9 PowerPAD
    4. 8.4 Device Functional Modes
      1. 8.4.1 PoE Overview
        1. 8.4.1.1  Threshold Voltages
        2. 8.4.1.2  PoE Start-Up Sequence
        3. 8.4.1.3  Detection
        4. 8.4.1.4  Hardware Classification
        5. 8.4.1.5  Inrush and Start-up
        6. 8.4.1.6  Maintain Power Signature
        7. 8.4.1.7  Start-up and Operation
        8. 8.4.1.8  PD Hotswap Operation
        9. 8.4.1.9  CDB and T2P
        10. 8.4.1.10 Auxiliary Pass MOSFET Control
        11. 8.4.1.11 Using DEN to Disable PoE
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Input Bridges and Schottky Diodes
        2. 9.2.2.2 Protection, D1
        3. 9.2.2.3 Capacitor, C1
        4. 9.2.2.4 Detection Resistor, RDEN
        5. 9.2.2.5 Classification Resistor, RCLS
        6. 9.2.2.6 External Boost Circuit
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 EMI Containment
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations and OTSD
    4. 11.4 ESD
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Parameter Measurement Information

TPS2379 PD_class_state_lvsb98.gifFigure 15. PD Class State Diagram