SNVSBM4B march   2022  – may 2023 TPS389006-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I2C
      2. 8.3.2 Auto Mask (AMSK)
      3. 8.3.3 PEC
      4. 8.3.4 VDD
      5. 8.3.5 MON
      6. 8.3.6 NIRQ
      7. 8.3.7 ADC
      8. 8.3.8 Time Stamp
    4. 8.4 Device Functional Modes
      1. 8.4.1 Built-In Self Test and Configuration Load
        1. 8.4.1.1 Notes on BIST Execution
      2. 8.4.2 TPS389006-Q1 Power ON
      3. 8.4.3 General Monitoring
        1. 8.4.3.1 IDLE Monitoring
        2. 8.4.3.2 ACTIVE Monitoring
        3. 8.4.3.3 Sequence Monitoring 1
          1. 8.4.3.3.1 ACT Transitions 0→1
          2. 8.4.3.3.2 SLEEP Transition 1→0
          3. 8.4.3.3.3 SLEEP Transition 0→1
        4. 8.4.3.4 Sequence Monitoring 2
          1. 8.4.3.4.1 ACT Transition 1→0
    5. 8.5 Register Maps
      1. 8.5.1 BANK0 Registers
      2. 8.5.2 BANK1 Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Automotive Multichannel Sequencer and Monitor
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Power Supply Guidelines
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Documentation Support
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • ASIL-D Functional Safety-Compliant
    • Development target for Functional Safety applications
    • Documentation to aid ISO 26262 system design
    • Systematic capability up to ASIL D
    • Hardware capability up to ASIL D
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C
  • Monitor state-of-the art SOCs
    • ±6 mV threshold accuracy (–40°C to +125°C)
    • Input voltage range: 2.5 V to 5.5 V
    • Undervoltage lockout (UVLO): 2.48 V
    • Low standby quiescent current: 200 µA
    • 6 channels with 2 remote sense
    • Fixed window threshold levels
      • 5 mV steps from 0.2 V to 1.475 V
      • 20 mV steps from 0.8 V to 5.5 V
  • Miniature solution and minimal component cost
    • 3 mm x 3 mm QFN package
    • Adjustable glitch immunity via I2C
    • User adjustable voltage threshold levels via I2C
  • Designed for safety applications
    • Active-low open-drain NIRQ output
    • Built-in 8-bit ADC for real-time voltage readouts
    • Cyclic Redundancy Checking (CRC)
    • Packet Error Checking (PEC)
    • Sequence and fault logging
  • Sync function for rail tagging