SLVS500D DECEMBER   2003  – June 2019 TPS54110

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
  4. 4 Revision History
  5. 5 Device Information
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VBIAS Regulator (VBIAS)
      2. 8.3.2 Voltage Reference
      3. 8.3.3 Oscillator and PWM Ramp
      4. 8.3.4 Error Amplifier
      5. 8.3.5 PWM Control
      6. 8.3.6 Dead-Time Control and MOSFET Drivers
      7. 8.3.7 Overcurrent Protection
      8. 8.3.8 Thermal Shutdown
      9. 8.3.9 Power Good (PWRDG)
    4. 8.4 Undervoltage Lockout (UVLO)
    5. 8.5 Slow-Start/Enable (SS/ENA)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical TPS54110 Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Switching Frequency
          2. 9.2.1.2.2 Input Capacitors
          3. 9.2.1.2.3 Output Filter Components
            1. 9.2.1.2.3.1 Inductor Selection
            2. 9.2.1.2.3.2 Capacitor Selection
          4. 9.2.1.2.4 Compensation Components
          5. 9.2.1.2.5 Bias and Bootstrap Capacitors
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Very-Small Form-Factor Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Two-Output Sequenced-Startup Application
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Layout Considerations For Thermal Performance
    4. 10.4 Grounding and Powerpad Layout
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.7 Overcurrent Protection

Cycle-by-cycle current limiting is achieved by sensing the current flowing through the high-side MOSFET and differential amplifier and comparing it to the preset overcurrent threshold. The high-side MOSFET is turned off within 200 ns of reaching the current-limit threshold. A 100-ns leading-edge blanking circuit prevents false tripping of the current limit. Current-limit detection occurs only when current flows from VIN to PH when sourcing current to the output filter. Load protection during current-sink operation is provided by thermal shutdown.