SLVS892F December   2008  – April 2019 TPS61175

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switching Frequency
      2. 7.3.2 Soft Start
      3. 7.3.3 Overcurrent Protection
      4. 7.3.4 Enable and Thermal Shutdown
      5. 7.3.5 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Minimum ON Time and Pulse Skipping
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design with WEBENCH Tools
        2. 8.2.2.2  Determining the Duty Cycle
        3. 8.2.2.3  Selecting the Inductor
        4. 8.2.2.4  Computing the Maximum Output Current
        5. 8.2.2.5  Setting Output Voltage
        6. 8.2.2.6  Setting the Switching Frequency
        7. 8.2.2.7  Setting the Soft-Start Time
        8. 8.2.2.8  Selecting the Schottky Diode
        9. 8.2.2.9  Selecting the Input and Output Capacitors
        10. 8.2.2.10 Compensating the Small Signal Control Loop
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Development Support
      1. 11.2.1 Custom Design with WEBENCH Tools
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

  • As for all switching power supplies, especially those running at high switching frequency and high currents, layout is an important design step. If layout is not carefully done, the regulator could suffer from instability as well as noise problems. To maximize efficiency, switch rise and fall times are very fast. To prevent radiation of high frequency noise (for example, EMI), proper layout of the high frequency switching path is essential.
  • Minimize the length and area of all traces connected to the SW pin and always use a ground plane under the switching regulator to minimize interplane coupling.
  • The high current path including the switch, Schottky diode, and output capacitor, contains nanosecond rise and fall times and must be kept as short as possible.
  • The input capacitor must not only to be close to the VIN pin, but also to the GND pin in order to reduce the Iinput supply ripple.