SLVSAN3B December   2010  – November 2016 TPS61199

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supply Voltage
      2. 7.3.2 Boost Controller
      3. 7.3.3 Switching Frequency
      4. 7.3.4 Enable and Undervoltage Lockout
      5. 7.3.5 Start-Up
      6. 7.3.6 Unused LED String
      7. 7.3.7 Program LED Full-Scale Current
      8. 7.3.8 PWM Dimming
      9. 7.3.9 Drive High Current LED
    4. 7.4 Device Functional Modes
      1. 7.4.1 Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Schottky Diode
        3. 8.2.2.3 Switch MOSFET and Gate Driver Resistor
        4. 8.2.2.4 Current Sense and Current Sense Filtering
        5. 8.2.2.5 Output Capacitor
        6. 8.2.2.6 Loop Consideration
      3. 8.2.3 Application Curves
      4. 8.2.4 Additional Application Circuits
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Consideration
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

NS Package
20-Pin SO
Top View
TPS61199 pinout_sop_20_ns_slvsan3.gif
PWP Package
20-Pin HTSSOP
Top View
TPS61199 pinout_httsop_20_pwp_slvsan3.gif

Pin Functions

PIN TYPE DESCRIPTION
NAME NO.
COMP 2 Output Loop compensation pin. Connect an RC network to make loop stable (see Loop Consideration ).
EN 5 Input Enable/disable pin — high = device is enabled; low = device is disabled.
FBP 1 Output LED short-across protection threshold program pin (see Protection)
FSW 3 Output Boost switching frequency selection pin. Connect a resistor to set the frequency between 300 kHz to 800 kHz.
GDRV 17 Output External Switch MOSFET gate driver output pin
GND 15 Ground Ground pin
IFB1 to IFB8 7, 8, 9, 10, 11
12, 13, 14 		Input Regulated current sink input pins.
ISET 4 Output Full-scale LED current selection pin; connect a resistor to program LED current for each string
ISNS 16 Input External MOSFET current sense positive input pin
OVP 20 Input Overvoltage protection pin (see Protection)
PWM 6 Input PWM dimming signal input pin. The frequency must be in the range of 100 Hz to 22 kHz.
VDD 19 Output Internal regulator output pin. Connect a 2.2-μF capacitor between this pin to GND.
VIN 18 Input Supply input pin. This pin can be tied to a voltage different from the power stage input.
PowerPAD – HTTSOP package — The PowerPAD pad must be soldered to the ground. If possible, use thermal vias to connect to top and internal ground plane layers for ideal power dissipation.