SLVSCZ5B July   2016  – October 2018 TPS61230A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
      2.      Efficiency
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Startup
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Under-Voltage Lockout (UVLO)
      4. 7.3.4 Current Limit Operation
      5. 7.3.5 Over Voltage Protection
      6. 7.3.6 Load Disconnect
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode
      2. 7.4.2 PFM Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS61230A 2.5-V to 4.5-V Input, 5-V Output Converter
        1. 8.2.1.1 TPS61230A 5-V Output Design Requirements
        2. 8.2.1.2 TPS61230A 5-V Detailed Design Procedure
          1. 8.2.1.2.1 Programming The Output Voltage
          2. 8.2.1.2.2 Inductor and Capacitor Selection
            1. 8.2.1.2.2.1 Inductor Selection
            2. 8.2.1.2.2.2 Output Capacitor Selection
            3. 8.2.1.2.2.3 Input Capacitor Selection
          3. 8.2.1.2.3 Loop Stability, Feed Forward Capacitor
        3. 8.2.1.3 TPS61230A 5-V Output Application Performance Plots
      2. 8.2.2 Systems Example - TPS61230A with Feed Forward Capacitor for Best Transient Response
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Two basic approaches for enhancing thermal performance are listed below.

  • Improving the power dissipation capability of the PCB design
  • Introducing airflow in the system

For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).