SLVSEA0B january   2018  – june 2023 TPS61280D , TPS61280E , TPS61281D

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 I2C Interface Timing Characteristics #GUID-BD85FD7C-B9AF-4F5D-9DFF-CD61365A592A/SLVS5401494
    7. 8.7 I2C Timing Diagrams
    8. 8.8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Voltage Scaling Management (VSEL)
      2. 9.3.2 Spread Spectrum, PWM Frequency Dithering
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Save Mode
      2. 9.4.2 Pass-Through Mode
      3. 9.4.3 Mode Selection
      4. 9.4.4 Current Limit Operation
      5. 9.4.5 Start-Up and Shutdown Mode
      6. 9.4.6 Undervoltage Lockout
      7. 9.4.7 Thermal Shutdown
      8. 9.4.8 Fault State and Power-Good
    5. 9.5 Programming
      1. 9.5.1 Serial Interface Description (TPS61280D/E)
      2. 9.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 9.5.3 HS-Mode Protocol
      4. 9.5.4 TPS6128xD/E I2C Update Sequence
    6. 9.6 Register Maps
      1. 9.6.1  Slave Address Byte
      2. 9.6.2  Register Address Byte
      3. 9.6.3  I2C Registers, E2PROM, Write Protect
      4. 9.6.4  E2PROM Configuration Parameters
      5. 9.6.5  CONFIG Register [reset = 0x01]
      6. 9.6.6  VOUTFLOORSET Register [reset = 0x02]
      7. 9.6.7  VOUTROOFSET Register [reset = 0x03]
      8. 9.6.8  ILIMSET Register [reset = 0x04]
      9. 9.6.9  Status Register [reset = 0x05]
      10. 9.6.10 E2PROMCTRL Register [reset = 0xFF]
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 TPS61281D with 2.5V-4.35 VIN, 1500 mA Output Current (TPS61280D with default I2C Configuration)
        1. 10.2.1.1 Design Requirement
        2. 10.2.1.2 Detailed Design Parameters
          1. 10.2.1.2.1 Inductor Selection
          2. 10.2.1.2.2 Output Capacitor
          3. 10.2.1.2.3 Input Capacitor
          4. 10.2.1.2.4 Checking Loop Stability
        3. 10.2.1.3 Application Performance Curves
      2. 10.2.2 TPS61282D with 2.5V-4.35 VIN, 2000 mA Output Current (TPS61280D with I2C Programmable)
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedures
        3. 10.2.2.3 Application Performance Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Information
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  15. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Summary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.3 Thermal Information

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

  • Improving the power dissipation capability of the PCB design
  • Improving the thermal coupling of the component to the PCB
  • Introducing airflow in the system

As power demand in portable designs is more and more important, designers must figure the best trade-off between efficiency, power dissipation and solution size. Due to integration and miniaturization, junction temperature can increase significantly which could lead to bad application behaviors (that is, premature thermal shutdown or worst case reduce device reliability).

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. The device operating junction temperature (TJ) should be kept below 125°C.