SLVS957E June   2009  – April 2016 TPS61300 , TPS61301 , TPS61305

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Safety Timer Accuracy
      2. 8.3.2  LED Failure Modes and Overvoltage Protection
      3. 8.3.3  Start-Up Sequence
      4. 8.3.4  Power Good (Flash Ready)
      5. 8.3.5  LED Temperature Monitoring (TPS61305, TPS61305A, TPS61306)
      6. 8.3.6  Hot Die Detector
      7. 8.3.7  NRESET Input: Hardware Enable and Disable
      8. 8.3.8  ENDCL Input: DC Light Hardware Control
      9. 8.3.9  Flashlight Blanking (Tx-MASK)
      10. 8.3.10 Undervoltage Lockout
      11. 8.3.11 Storage Capacitor Active Cell Balancing
      12. 8.3.12 RED Light Privacy Indicator
      13. 8.3.13 White LED Privacy Indicator
      14. 8.3.14 Storage Capacitor, Precharge Voltage Calibration
      15. 8.3.15 Storage Capacitor, Adaptive Precharge Voltage
      16. 8.3.16 Serial Interface Description
    4. 8.4 Device Functional Modes
      1. 8.4.1  Down-Mode in Voltage Regulation Mode
      2. 8.4.2  LED High-Current Regulators, Unused Inputs
      3. 8.4.3  Power-Save Mode Operation, Efficiency
      4. 8.4.4  Mode of Operation: DC Light and Flashlight
      5. 8.4.5  Flash Strobe is Level Sensitive (STT = 0): LED Strobe Follows FLASH_SYNC Input
      6. 8.4.6  Flash Strobe Is Leading Edge Sensitive (STT = 1): One-Shot LED Strobe
      7. 8.4.7  Current Limit Operation
      8. 8.4.8  Hardware Voltage Mode Selection
      9. 8.4.9  Shutdown
      10. 8.4.10 Thermal Shutdown
      11. 8.4.11 F/S-Mode Protocol
      12. 8.4.12 HS-Mode Protocol
      13. 8.4.13 TPS6130xx I2C Update Sequence
    5. 8.5 Register Maps
      1. 8.5.1  Slave Address Byte
      2. 8.5.2  Register Address Byte
      3. 8.5.3  REGISTER1 (TPS61300, TPS61301)
      4. 8.5.4  REGISTER1 (TPS61305, TPS61305A, TPS61306)
      5. 8.5.5  REGISTER2 (TPS61300, TPS61301)
      6. 8.5.6  REGISTER2 (TPS61305, TPS61305A, TPS61306)
      7. 8.5.7  REGISTER3
      8. 8.5.8  REGISTER4
      9. 8.5.9  REGISTER5
      10. 8.5.10 REGISTER6 (TPS61300, TPS61301)
      11. 8.5.11 REGISTER6 (TPS61305, TPS61305A)
      12. 8.5.12 REGISTER7
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 4100-mA Two White High-Power LED Flashlight Featuring Storage Capacitor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection
          2. 9.2.1.2.2 Input Capacitor
          3. 9.2.1.2.3 Output Capacitor
          4. 9.2.1.2.4 NTC Selection (TPS61305, TPS61305A, TPS61306)
          5. 9.2.1.2.5 Checking Loop Stability
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TPS61300 Typical Application
        1. 9.2.2.1 Design Requirement
        2. 9.2.2.2 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 2x 600-mA High-Power White LED Solution Featuring Privacy Indicator
      2. 9.3.2 White LED Flashlight Driver and Audio Amplifier Power Supply Operating Simultaneously
      3. 9.3.3 White LED Flashlight Driver and Audio Amplifier Power Supply Operating Simultaneously
      4. 9.3.4 White LED Flashlight Driver and Audio Amplifier Power Supply Exclusive Operation
      5. 9.3.5 White LED Flashlight Driver and Auxiliary Lighting Zone Power Supply
      6. 9.3.6 TPS61300, Typical Application
      7. 9.3.7 TPS61301, Typical Application
      8. 9.3.8 TPS61305 Typical Application
      9. 9.3.9 TPS61306, Typical Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks.

The input capacitor, output capacitor, and the inductor must be placed as close as possible to the IC. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.

To lay out the control ground, TI recommends using short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current.

11.2 Layout Example

TPS61300 TPS61301 TPS61305 TPS61305A TPS61306 top_layout_lvs957.gif Figure 107. Suggested Layout (Top)

11.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

  • Improving the power dissipation capability of the PCB design
  • Improving the thermal coupling of the component to the PCB
  • Introducing airflow in the system

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. The maximum junction temperature (TJ) of the TPS6130xx is 150°C.

The maximum power dissipation is especially critical when the device operates in the linear down mode at high LED current. For single pulse power thermal analysis (for example, flashlight strobe), the allowable power dissipation for the device is given by Figure 108. These values are derived using the reference design.

TPS61300 TPS61301 TPS61305 TPS61305A TPS61306 sing_pulse_lvs957.gif Figure 108. Single Pulse Power Capability