SLVSAC3D May   2011  – December 2014 TPS62730 , TPS62732 , TPS62733

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (Continued)
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 DCS-Control™
      2. 9.3.2 ON/BYP Mode Selection
      3. 9.3.3 STAT Open-Drain Output
    4. 9.4 Device Functional Modes
      1. 9.4.1 Start-Up
      2. 9.4.2 Automatic Transition from DC-DC to Bypass Operation
      3. 9.4.3 Internal Current Limit
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Output Filter Design (Inductor and Output Capacitor)
        2. 10.2.2.2 Inductor Selection
        3. 10.2.2.3 DC-DC Output Capacitor Selection
        4. 10.2.2.4 Additional Decoupling Capacitors
        5. 10.2.2.5 Input Capacitor Selection
          1. 10.2.2.5.1 Input Buffer Capacitor Selection
        6. 10.2.2.6 Checking Loop Stability
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (December 2012) to D Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go