SLVSBG2A September   2013  – June 2016 TPS65154

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Simplified System Diagram
  2. 2 Revision History
  3. 3 Pin Configuration and Functions
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing Requirements
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1  Linear Regulator (VCC)
        1. 5.3.1.1 Power-Up (Linear Regulator)
        2. 5.3.1.2 Power-Down (Linear Regulator)
        3. 5.3.1.3 Protection (Linear Regulator)
      2. 5.3.2  Boost Converter 1 (AVDD)
        1. 5.3.2.1 Power-Up (Boost Converter 1)
        2. 5.3.2.2 Power-Down (Boost Converter 1)
        3. 5.3.2.3 Protection (Boost Converter 1)
      3. 5.3.3  Boost Converter 2 (VGH)
        1. 5.3.3.1 Power-Up (Boost Converter 2)
        2. 5.3.3.2 Power-Down (Boost Converter 2)
        3. 5.3.3.3 Protection (Boost Converter 2)
      4. 5.3.4  Negative Charge Pump (VGL)
        1. 5.3.4.1 Power-Up (Negative Charge Pump)
        2. 5.3.4.2 Power-Down (Negative Charge Pump)
        3. 5.3.4.3 Protection (Negative Charge Pump)
      5. 5.3.5  Gate Voltage Shaping
      6. 5.3.6  Panel Discharge (XAO)
      7. 5.3.7  Reset Generator (RST)
      8. 5.3.8  Programmable VCOM
        1. 5.3.8.1 Operational Amplifier Performance
        2. 5.3.8.2 Power-Up (Programmable VCOM)
        3. 5.3.8.3 Power-Down (Programmable VCOM)
      9. 5.3.9  WLED Driver
        1. 5.3.9.1 WLED Boost Converter
        2. 5.3.9.2 Current Sinks
        3. 5.3.9.3 Protection
        4. 5.3.9.4 Enable and Start-Up
      10. 5.3.10 Undervoltage Lockout
    4. 5.4 Device Functional Modes
      1. 5.4.1 Dimming Modes
        1. 5.4.1.1 Direct Dimming
        2. 5.4.1.2 Phase-Shift Dimming
      2. 5.4.2 Power Sequencing
        1. 5.4.2.1 Power-Up
        2. 5.4.2.2 Power-Down
    5. 5.5 Programming
      1. 5.5.1 Configuration
        1. 5.5.1.1 General
          1. 5.5.1.1.1 I2C Interface
          2. 5.5.1.1.2 Slave Addresses
          3. 5.5.1.1.3 Write Protect
      2. 5.5.2 Programming Examples (Excluding VCOM)
        1. 5.5.2.1 Writing to a Single RAM Register
        2. 5.5.2.2 Writing to Multiple RAM Registers
        3. 5.5.2.3 Saving Contents of all RAM Registers to EEPROM
        4. 5.5.2.4 Reading from a Single RAM Register
        5. 5.5.2.5 Reading from a Single EEPROM Register
        6. 5.5.2.6 Reading from Multiple RAM Registers
        7. 5.5.2.7 Reading from Multiple EEPROM Registers
      3. 5.5.3 Programming Examples - VCOM
        1. 5.5.3.1 Writing a VCOM Value of 77h to WR
        2. 5.5.3.2 Writing a VCOM Value of 77h to IVR and WR
        3. 5.5.3.3 Reading a VCOM Value of 77h from WR
        4. 5.5.3.4 Reading a VCOM Value of 77h from IVR
    6. 5.6 Register Map
      1. 5.6.1 Configuration Registers (Excluding VCOM)
        1. 5.6.1.1  CONFIG (00h)
        2. 5.6.1.2  VCC (01h)
        3. 5.6.1.3  DLY1 (02h)
        4. 5.6.1.4  AVDD (03h)
        5. 5.6.1.5  FSW1 (04h)
        6. 5.6.1.6  SS2 (05h)
        7. 5.6.1.7  DLY2 (06h)
        8. 5.6.1.8  VGL (07h)
        9. 5.6.1.9  SS3 (08h)
        10. 5.6.1.10 DLY3 (09h)
        11. 5.6.1.11 VGH (0Ah)
        12. 5.6.1.12 SS4 (0Bh)
        13. 5.6.1.13 FSW3 (0Ch)
        14. 5.6.1.14 DLY4 (0Dh)
        15. 5.6.1.15 OVP (0Eh)
        16. 5.6.1.16 FDIM (OFh)
        17. 5.6.1.17 RESET (10h)
        18. 5.6.1.18 VDET (11h)
        19. 5.6.1.19 DLY6 (12h)
        20. 5.6.1.20 VMAX (13h)
        21. 5.6.1.21 VMIN (14h)
        22. 5.6.1.22 USER (15h)
        23. 5.6.1.23 CONTROL (FFh)
      2. 5.6.2 VCOM Registers
        1. 5.6.2.1 VCOM DATA (Slave Address 28h, Register Address 00h)
        2. 5.6.2.2 VCOM CONTROL (Slave Address 28h, Register Address 02h)
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 External Component Selection
      3. 6.2.3 Application Curves
  7. 7 Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Community Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Device and Documentation Support

9.1 Device Support

9.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

9.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

9.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

9.6 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.