SWCS049S June   2010  – August 2018 TPS65911

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison Table
  4. 4Pin Configuration and Functions
    1. 4.1 Pin Attributes
      1.      Pin Attributes
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: I/O Pullup and Pulldown
    6. 5.6  Electrical Characteristics: Digital I/O Voltage
    7. 5.7  Electrical Characteristics: Power Consumption
    8. 5.8  Electrical Characteristics: Power References and Thresholds
    9. 5.9  Electrical Characteristics: Thermal Monitoring and Shutdown
    10. 5.10 Electrical Characteristics: 32-kHz RTC Clock
    11. 5.11 Electrical Characteristics: Backup Battery Charger
    12. 5.12 Electrical Characteristics: VRTC LDO
    13. 5.13 Electrical Characteristics: VIO SMPS
    14. 5.14 Electrical Characteristics: VDD1 SMPS
    15. 5.15 Electrical Characteristics: VDD2 SMPS
    16. 5.16 Electrical Characteristics: VDDCtrl SMPS
    17. 5.17 Electrical Characteristics: LDO1 and LDO2
    18. 5.18 Electrical Characteristics: LDO3 and LDO4
    19. 5.19 Electrical Characteristics: LDO5
    20. 5.20 Electrical Characteristics: LDO6, LDO7, and LDO8
    21. 5.21 Timing and Switching Characteristics
      1. 5.21.1 I2C Timing and Switching
      2. 5.21.2 Switch-ON and Switch-OFF Sequences and Timing
      3. 5.21.3 Power Control Timing
        1. 5.21.3.1 Device State Control Through PWRON Signal
        2. 5.21.3.2 Device SLEEP State Control
        3. 5.21.3.3 Device Turnon and Turnoff With Rising and Falling Input Voltage
        4. 5.21.3.4 Power Supplies State Control Through EN1 and EN2 Signals
        5. 5.21.3.5 VDD1, VDD2 Voltage Control Through EN1 and EN2 Signals
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Power Reference
    4. 6.4  Power Resources
    5. 6.5  Embedded Power Controller (EPC)
      1. 6.5.1 State Machine
        1. 6.5.1.1 Device POWER ON Enable Conditions
        2. 6.5.1.2 Device POWER ON Disable Conditions
        3. 6.5.1.3 Device SLEEP Enable Conditions
        4. 6.5.1.4 Device Reset Scenarios
      2. 6.5.2 BOOT Configuration, Switch-ON, and Switch-OFF Sequences
      3. 6.5.3 Control Signals
        1. 6.5.3.1  SLEEP
        2. 6.5.3.2  PWRHOLD
        3. 6.5.3.3  BOOT1
        4. 6.5.3.4  NRESPWRON, NRESPWRON2
        5. 6.5.3.5  CLK32KOUT
        6. 6.5.3.6  PWRON
        7. 6.5.3.7  INT1
        8. 6.5.3.8  EN2 and EN1
        9. 6.5.3.9  GPIO0 to GPIO8
        10. 6.5.3.10 HDRST Input
        11. 6.5.3.11 PWRDN
        12. 6.5.3.12 Comparators: COMP1 and COMP2
        13. 6.5.3.13 Watchdog
        14. 6.5.3.14 Tracking LDO
    6. 6.6  PWM and LED Generators
    7. 6.7  Dynamic Voltage Frequency Scaling and Adaptive Voltage Scaling Operation
    8. 6.8  32-kHz RTC Clock
    9. 6.9  Real Time Clock (RTC)
      1. 6.9.1 Time Calendar Registers
      2. 6.9.2 General Registers
      3. 6.9.3 Compensation Registers
    10. 6.10 Backup Battery Management
    11. 6.11 Backup Registers
    12. 6.12 I2C Interface
      1. 6.12.1 Access Protocols
        1. 6.12.1.1 Single Byte Access
        2. 6.12.1.2 Multiple Byte Access to Several Adjacent Registers
    13. 6.13 Thermal Monitoring and Shutdown
    14. 6.14 Interrupts
    15. 6.15 Register Maps
      1. 6.15.1 Functional Registers
        1. 6.15.1.1 TPS65911_FUNC_REG Registers Mapping Summary
        2. 6.15.1.2 TPS65911_FUNC_REG Register Descriptions
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 External Component Recommendation
        2. 7.2.2.2 Controller Design Procedure
          1. 7.2.2.2.1 Inductor Selection
          2. 7.2.2.2.2 Selecting the RTRIP Resistor
          3. 7.2.2.2.3 Selecting the Output Capacitors
          4. 7.2.2.2.4 Selecting FETs
          5. 7.2.2.2.5 Bootstrap Capacitor
          6. 7.2.2.2.6 Selecting Input Capacitors
        3. 7.2.2.3 Converter Design Procedure
          1. 7.2.2.3.1 Selecting the Inductor
          2. 7.2.2.3.2 Selecting Output Capacitors
          3. 7.2.2.3.3 Selecting Input Capacitors
      3. 7.2.3 Application Curves
      4. 7.2.4 Layout Guidelines
        1. 7.2.4.1 PCB Layout
      5. 7.2.5 Layout Example
    3. 7.3 Power Supply Recommendations
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Community Resources
      1. 8.4.1 Community Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Package Description

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.2.1 External Component Recommendation

For crystal oscillator components, see Section 5.10. If RTC domain is expected to be maintained after shutdown, VCC7 must have enough capacitance to make sure that when supply is switched off, voltage does not fall at a rate faster than 10 mV/ms. This makes sure that RTC domain data is maintained.

Table 7-2 External Component Recommendation

PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
POWER REFERENCES
VREF filtering capacitor (CO(VREF)) Connected from VREF to REFGND 100 nF
VDD1 SMPS
Input capacitor (CI(VCC1)) X5R or X7R dielectric 10 µF
Output filter capacitor (CO(VDD1)) X5R or X7R dielectric 4 10 12 µF
CO filter capacitor ESR ƒ = 3 MHz 10 300 mΩ
Inductor (LO(VDD1)) 2.2 µH
LO inductor DC resistor (DCRL) 125 mΩ
VDD2 SMPS
Input capacitor (CI(VCC2)) X5R or X7R dielectric 10 µF
Output filter capacitor (CO(VDD2)) X5R or X7R dielectric 4 10 12 µF
CO filter capacitor ESR ƒ = 3 MHz 10 300 mΩ
Inductor (LO(VDD2)) 2.2 µH
LO inductor DC resistor (DCRL) 125 mΩ
VIO SMPS
Input capacitor (CI(VCCIO)) X5R or X7R dielectric 10 µF
Output filter capacitor (CO(VIO)) X5R or X7R dielectric 4 10 12 µF
CO filter capacitor ESR ƒ = 3 MHz 10 300 mΩ
Inductor (LO(VIO)) 2.2 µH
LO inductor DC resistor (DCRL) 125 mΩ
VDDCtrl SMPS
Input capacitor (CVIN) 4 × 10 µF
High-side drive boost capacitor (Cboost) 0.1 µF
Input capacitor for V5IN supply (CV5IN) 1 µF
Output filter capacitor (CO(VDDCtrl)) 330 µF
CO filter capacitor ESR 9 15 mΩ
Inductor (LO(VDDCtrl)) 2.7 µH
LO Inductor DC resistor (DCRL) 20 mΩ
Trip resistance (Rtrip) 40 kΩ
Feed forward capacitor (C1) 330 pF
FET FDMC7660
LDO1
Input capacitor (CI(VCC6)) X5R or X7R dielectric 4.7 µF
Output filtering capacitor (CO(LDO1)) 0.8 2.2 2.64 µF
CO filtering capacitor ESR 0 500 mΩ
LDO2
Output filtering capacitor (CO(LDO2)) 0.8 2.2 2.64 µF
CO filtering capacitor ESR 0 500 mΩ
LDO3
Input capacitor (CI(VCC5)) X5R or X7R dielectric 4.7 µF
Output filtering capacitor (CO(LDO3)) 0.8 2.2 2.64 µF
CO filtering capacitor ESR 0 500 mΩ
LDO4
Output filtering capacitor (CO(LDO4)) 0.8 2.2 2.64 µF
CO filtering capacitor ESR 0 500 mΩ
LDO5
Input capacitor (CI(VCC4)) X5R or X7R dielectric 4.7 µF
Output filtering capacitor (CO(LDO5)) 0.8 2.2 2.64 µF
CO filtering capacitor ESR 0 500 mΩ
LDO6
Input capacitor (CI(VCC3)) X5R or X7R dielectric 4.7 µF
Output filtering capacitor (CO(LDO6)) 0.8 2.2 2.64 µF
CO filtering capacitor ESR 0 500 mΩ
LDO7
Output filtering capacitor (CO(LDO7)) 0.8 2.2 2.64 µF
CO filtering capacitor ESR 0 500 mΩ
LDO8
Output filtering capacitor (CO(LDO8)) 0.8 2.2 2.64 µF
CO filtering capacitor ESR 0 500 mΩ
VRTC LDO
Input capacitor (CI(VCC7)) X5R or X7R dielectric 4.7 µF
Output filtering capacitor (CO(VRTC)) 0.8 2.2 2.64 µF
CO filtering capacitor ESR 0 500 mΩ
BACKUP BATTERY
Backup battery capacitor (CBB) 5 10 2000 mF
Series resistors CBB = 5 mF to 15 mF 10 1500 Ω