SBVS358C June   2018  – May 2022 TPS746-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Input and Output Capacitor Selection
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Exiting Dropout
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Power-Good Function
      8. 8.1.8 Feed-Forward Capacitor (CFF)
      9. 8.1.9 Start-Up Sequencing
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at operating temperature range (TJ = –40°C to +150°C), VIN = VOUT(NOM) + 0.5 V or 1.5 V (whichever is greater), IOUT = 1 mA, VEN = VIN, and CIN = COUT = 1 µF (unless otherwise noted); all typical values at TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback voltage 0.55 V
Output accuracy(1) TJ = 25°C –0.85% 0.85%
-40°C ≤ TJ ≤ 85°C –1.00% 1.00%
-40°C ≤ TJ ≤ 150°C –1.50% 1.50%
Line regulation VOUT(NOM) + 0.5 V(2) ≤ VIN ≤ 6.0 V 2 7.5 mV
Load regulation 0.1 mA ≤ IOUT ≤ 1 A, VIN ≥ 2.0 V 0.030 V/A
IGND Ground current IOUT = 0 mA TJ = 25°C  25 32 µA
-40°C ≤ TJ ≤ 150°C 25 36
ISHDN Shutdown current VEN ≤ 0.3 V,
1.5 V ≤ VIN ≤ 6.0 V		 -40°C ≤ TJ ≤ 125°C 0.1 1 µA
-40°C ≤ TJ ≤ 150°C 0.1 1.55
IFB Feedback pin current Adjustable only 0.01 0.1 µA
ICL Output current limit VOUT(NOM) < 1 V,
VOUT = VOUT(NOM) - 0.2 V, VIN = 2.0 V		 1.22 1.5 1.83 A
VOUT(NOM) ≥ 1 V,
VOUT = VOUT(NOM) × 0.85, VIN = VOUT(NOM) + 1.0 V
ISC Short-circuit current limit VOUT = 0 V VOUT(NOM) < 1 V,
VIN = 2.0 V		 500 680 850 mA
VOUT(NOM) ≥ 1 V,
VIN = VOUT(NOM) + 1.0 V
VDO Dropout voltage IOUT = 1 A,
VOUT = 0.95 x VOUT(NOM)		 0.65 V ≤ VOUT < 0.8 V(3) 895 1090 mV
0.8 V ≤ VOUT < 0.9 V 765 960
0.9 V ≤ VOUT < 1.0 V 700 890
1.0 V ≤ VOUT < 1.2 V 600 790
1.2 V ≤ VOUT < 1.5 V 465 625
1.5 V ≤ VOUT < 1.8 V 335 480
1.8 V ≤ VOUT < 2.5 V 265 400
2.5 V ≤ VOUT < 3.3 V 195 310
3.3 V ≤ VOUT ≤ 5.5 V 160 265
PSRR Power-supply rejection ratio VOUT = 1.8 V,
VIN = 2.8 V,
IOUT = 1 A,
COUT = 2.2 µF		 f = 1 kHz 53 dB
f = 100 kHz 38
f = 1 MHz 30
VN Output noise voltage BW = 10 Hz to 100 kHz, VOUT = 0.9 V, VIN = 1.9 V 53 µVRMS
VUVLO Undervoltage lockout VIN rising 1.21 1.33 1.47 V
VIN falling 1.17 1.29 1.42
VUVLO,HYST Undervoltage lockout hysteresis VIN hysteresis 40 mV
tSTR Startup time From EN low-to-high transition to VOUT = VOUT(NOM) x 95% 200 500 650 µs
VHI EN pin high voltage (enabled) 1.0 V
VLO EN pin low voltage (disabled) 0.3 V
IEN Enable pin current VIN = VEN = 6.0 V 10 nA
RPULLDOWN Pulldown resistance VIN = 6.0 V 95 Ω
PGHTH PG high threshold VOUT increasing 89 92 96 %VOUT
PGLTH PG low threshold VOUT decreasing 86 90 93 %VOUT
PGHYST PG hysteresis 2 %VOUT
VOL(PG) PG pin low-level output voltage VIN ≥ 1.5 V, ISINK = 1 mA 300 mV
VIN ≥ 2.75 V, ISINK = 2 mA
VOH(PG)
PG pin high-level output
voltage(4)
 		 VOUT ≥ 1.0 V, ISOURCE = 0.04 mA 0.8 × VOUT V
VOUT ≥ 1.4 V, ISOURCE = 0.2 mA
VOUT ≥ 2.5 V, ISOURCE = 0.5 mA
VOUT ≥ 4.5 V, ISOURCE = 1.0 mA
Ilkg(PG) PG pin leakage current(5) VOUT > PGHTH, VPG = 6.0 V 7 50 nA
TSD Thermal shutdown Shutdown, temperature increasing 170 °C
Reset, temperature decreasing 155
(1) When the device is connected to external feedback resistors at the FB pin, external resistor tolerances are not included.
(2) VIN = 1.5V for VOUT < 1.0 V
(3) Dropout is not tested for nominal output voltages below 0.65 V since the input voltage may be below UVLO.
(4) Push-pull version only. The push-pull option is supported only for VOUT ≥ 1.0 V.
(5) Open-drain version only.