SLVSAI4D September   2010  – December 2023 TPS74801-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics: IOUT = 50 mA
    7. 5.7 Typical Characteristics: IOUT = 1 A
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Programmable Soft-Start
      2. 6.3.2 Sequencing Requirements
      3. 6.3.3 Output Noise
      4. 6.3.4 Enable and Shutdown
      5. 6.3.5 Power Good
      6. 6.3.6 Internal Current Limit
      7. 6.3.7 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input, Output, and Bias Capacitor Requirements
        2. 7.2.2.2 Transient Response
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Layout Recommendations and Power Dissipation
        2. 7.4.1.2 Estimating Junction Temperature
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
      2. 8.1.2 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision C (July 2023) to Revision D (December 2023)

  • Added device verbiage throughout document to differentiate legacy chip and new chip informationGo
  • Changed Description section: Changed Turn-On Response figure and added temperature range for new chipGo
  • Changed Typical Characteristics sections to show legacy chip and new chip data side by side and deleted VIN Dropout Voltage vs VBIAS-VOUT curvesGo
  • Changed images in Estimating Junction Temperature sectionGo
  • Deleted RGW Example figure from Layout Example sectionGo
  • Added Device Nomenclature sectionGo

Changes from Revision B (July 2013) to Revision C (July 2023)

  • Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added M3 devices to documentGo
  • Changed automotive-specific Features bulletsGo
  • Changed QFN to VQFN throughout documentGo
  • Added links to Applications sectionGo
  • Deleted reference to TPS74401 from Description sectionGo
  • Added Design Requirements sectionGo
  • Changed footnote 1 on Standard Capacitor Values for Programming the Soft-Start Time tableGo
  • Added Application Curves sectionGo