SBVS254D February   2018  – August 2019 TPS7A05

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
      2.      Ground Current vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
      2. 7.3.2 Active Discharge
      3. 7.3.3 Low IQ in Dropout
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Enable
      6. 7.3.6 Internal Foldback Current Limit
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Dropout Mode
      3. 7.4.3 Disable Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Special Considerations When Ramping Down VIN and Enable
      4. 8.1.4 Load Transient Response
      5. 8.1.5 Dropout Voltage
        1. 8.1.5.1 Behavior When Transitioning From Dropout Into Regulation
        2. 8.1.5.2 Behavior of Output Resulting From Line Transient When in Dropout
      6. 8.1.6 Undervoltage Lockout (UVLO) Operation
      7. 8.1.7 Power Dissipation (PD)
        1. 8.1.7.1 Estimating Junction Temperature
        2. 8.1.7.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Design Considerations
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (April 2019) to D Revision

  • Changed DBZ package from APL to production dataGo
  • Added DBZ package to Load Regulation parameter in Electrical Characteristics table Go
  • Added DBZ package to Dropout voltage parameter in Electrical Characteristics tableGo
  • Added condition statement to IQ vs VIN and Temperature figure Go

Changes from B Revision (August 2018) to C Revision

  • Added DBZ package to document as APL releaseGo

Changes from A Revision (May 2018) to B Revision

  • Changed 1-mm × 1-mm to Small-Size in document title Go
  • Changed YKA (DSBGA) package status to production data Go
  • Added Accuracy for 1.825 V in Electrical Characteristics tableGo
  • Changed Output current limit in Electrical Characteristics tableGo
  • Added Output current limit for +85°C in Electrical Characteristics tableGo
  • Changed Short-circuit current limit in Electrical Characteristics tableGo
  • Added Dropout voltage for 1.825 V in Electrical Characteristics tableGo
  • Changed y-axis scaling and added conditions for IOUT Transient 0 mA to 100 mA figureGo
  • Changed y-axis scaling and added conditions for IOUT Transient 0 mA to 200 mA figure Go
  • Added IOUT Transient 0 mA to 50 mA figure to IOUT Transient 3 µA to 3 mA figureGo
  • Added slew rate condition to VIN Transient figures (IOUT = 100 mA and IOUT = 200 mA)Go
  • Added VIN Transient figures (IOUT = 150 mA and IOUT = 20 mA)Go
  • Added VIN condition to PSRR vs Frequency and IOUT figure (VOUT = 1.8 V)Go

Changes from * Revision (February 2018) to A Revision

  • Released to production Go