SLVSHK8 December   2023 TPSM64406

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range (VIN1, VIN2)
      2. 7.3.2  Enable EN Pin and Use as VIN UVLO
      3. 7.3.3  CONFIG Device Configuration Pin
      4. 7.3.4  Adjustable Switching Frequency
      5. 7.3.5  Spread Spectrum
      6. 7.3.6  Adjustable Output Voltage (FB)
      7. 7.3.7  Input Capacitors
      8. 7.3.8  Output Capacitors
      9. 7.3.9  SYNC Allows Clock Synchronization and Mode Selection
      10. 7.3.10 Power-Good Output Voltage Monitoring
      11. 7.3.11 Bias Supply Regulator (VCC, VOSNS)
      12. 7.3.12 Overcurrent Protection (OCP)
      13. 7.3.13 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1 – High-efficiency Dual Output 5 V at 3 A, 3.3 V at 3 A, Synchronous Buck Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Voltage Setpoint
          2. 8.2.1.2.2 Switching Frequency Selection
          3. 8.2.1.2.3 Input Capacitor Selection
          4. 8.2.1.2.4 Output Capacitor Selection
          5. 8.2.1.2.5 Other Considerations
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design 2 – High-efficiency 6 A Synchronous Buck Regulator for Industrial Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Voltage Setpoint
          2. 8.2.2.2.2 Switching Frequency Selection
          3. 8.2.2.2.3 Input Capacitor Selection
          4. 8.2.2.2.4 Output Capacitor Selection
          5. 8.2.2.2.5 Other Connections
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Design and Layout
      2. 8.4.2 Layout Example
  10. 9 Custom Design With WEBENCH® Tools
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

RCH package, 28-pin QFN with Wettable Flanks

GUID-20231005-SS0I-N2VR-BFSP-G0MBW3PZD1ZM-low.svg Figure 5-1 Dual Output (Top View)
GUID-20231005-SS0I-C28G-PKZH-CHCDC3HK1NXM-low.svg Figure 5-2 Single Output Primary (Top View)
GUID-20231005-SS0I-DVR3-CBNM-NCN6XWFMS3J8-low.svg Figure 5-3 Single Output Secondary (Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
DUAL OUTPUT SINGLE OUTPUT
14 VIN2 VIN2 I Input supply to the regulator. Connect a high quality bypass capacitors from this pin to PGND. Low impedance connection must be provided to VIN1.
15 BOOT2 BOOT2 I/O Channel 2 high-side driver upper supply rail. Connected to an internal 100-nF capacitor between SW2 and BOOT2. An internal diode charges the capacitor while SW2 is low. Mechanical connection, use as NC in design.
16, 17 SW2 SW2 P Channel 2 Switching node that is internally connected to the source of the high-side NMOS buck switch and the drain of the low-side NMOS synchronous rectifier. Mechanical connection, use as NC in design.
22, 23 SW1 SW1 P Channel 1 Switching node that is internally connected to the source of the high-side NMOS buck switch and the drain of the low-side NMOS synchronous rectifier. Mechanical connection, use as NC in design.
24 BOOT1 BOOT1 I/O Channel 1 High-side driver upper supply rail. Connected to an internal 100-nF between SW1 and BOOT1. An internal diode charges the capacitor while SW1 is low. Mechanical connection, use as NC in design.
25 VIN1 VIN1 I Input supply to the regulator. Connect a high quality bypass capacitors from this pin to PGND. Low impedance connection must be provided to VIN2.
27 SYNC SYNC I Multifunction pin. SYNC selects forced pulse width modulation (FPWM) or Diode Emulation mode. Connect SYNC to AGND to enable diode emulation mode. Connect SYNC to VCC to operate the TPSM6440x in FPWM mode with continuous conduction at light loads. SYNC can also be used as a synchronization input to synchronize the internal oscillator to an external clock. When used as a secondary device in single output configuration, the SYNC pin is connected to SYNC_OUT of the primary for clock timing.
1 PG1 MODE O Dual function pin. An open drain output that transitions low if VOSNS1 is outside a specified regulation window in dual output and single output primary configuration. In single output secondary mode configuration, this behaves as a mode pin to select between forced PWM (FPWM) mode and Diode Emulation Mode (DEM). Connect MODE of single output secondary to SYNC pin of single output primary to place them in the same mode of operation. For FPWM, connect MODE to VCC through a 10 kΩ resistor. For DEM connect to ground.
2 EN1 EN1 I An active high input TPSM6440x (VOH > 1.375 V) enables Output 1 in dual output operation. When in single output operation, an active high input enables all phases in the system. When disabled, the TPSM6440x is in shutdown mode. EN1 must never be floating.
3 BIAS & VOSNS1 BIAS & VOSNS1 I Output voltage sense and input to internal voltage regulator. Connect to non-switching side of the inductor. Connect an optional high quality 0.1-μF capacitor from this pin to AGND for best performance.
4 FB1 FB1 I Feedback input to channel 1 of the TPSM6440x in dual output operation and feedback input to all channels in single output operation. Connect FB1 to VCC through a 10 kΩ resistor for a 5-V output or connect FB1 to AGND for a 3.3-V output. A resistive divider from the non-switching side of the inductor to FB1 sets the output voltage level between 0.8 V and 20 V. The regulation threshold at FB1 is 0.8 V. For lower output voltages use at least a 10 kΩ for the top of the resistor divider.
5 VCC VCC O Internal regulator output. Used as supply to internal control circuits. Do not connect to any external loads. Connect a high quality 1-μF capacitor from this pin to AGND.
6 AGND AGND G Analog ground connection. Ground return for the internal voltage reference and analog circuits.
7 RT RT I Frequency programming pin. A resistor from RT to AGND sets the oscillator frequency between 100 kHz and 2.2 MHz.
8 FB2 SS I Dual function pin. When in dual output operation, the pin functions as FB2, feedback input to channel 2 of the TPSM6440x. Connect FB2 to VCC through a 10 kΩ resistor for a 5-V output or connect FB2 to AGND for a 3.3-V output. A resistive divider from the non-switching side of the inductor to FB2 sets the output voltage level between 0.8 V and 20 V. For lower output voltages use at least a 10 kΩ for the top of the resistor divider. When in single output mode, the pin functions as SS. An external capacitor must be placed from SS to AGND for external soft-start of the output. Connect the SS pins of primary and secondaries for fault communication between devices.
9 VOSNS2 COMP I Dual function pin. In dual output operation, the pin functions as VOSNS2 for the fixed 3.3-V and 5-V and adjustable output conditions. In single output operation, the pin is the output of the internal error amplifier.
10 EN2 EN2 I An active high input (VOH > 1.375 V) enables Output 2 in dual output operation. When in single output mode, EN2 of all TPSM6440x must be connected together. An active high input enables all secondary phases in the system. When disabled, only one channel in the primary TPSM6440x is active while all remaining phases are in shutdown mode. EN2 must never be floating.
11 CONFIG CONFIG I Single or Dual output selection. Connect specific resistor values to the pin (refer to Table 7-1) to select number of phases, primary and secondary and dither options.
12 PG2 SYNC_ OUT O Dual function pin. In dual output operation, this pin behaves as PG2, an open drain output that transitions low if VOSNS2 is outside a specified regulation window. In single output mode, the pin functions as SYNC_OUT and provides clock information from primary to secondary.
18, 19 VOUT2 VOUT O Output of module. Connect a high quality bypass capacitors from this pin to PGND.
20, 21 VOUT1 VOUT O Output of module. Connect a high quality bypass capacitors from this pin to PGND.
13. 26 PGND PGND G Power ground to internal low side MOSFET. Connect to system ground. Low impedance connection must be provided to PGND1, PGND3 and PGND4. Connect a high quality bypass capacitors from this pin to VIN2.
28 PGND PGND G Power ground and heat sink connection. Solder directly to system ground plane. Low impedance connection must be provided to other PGND pins.
(1) I = input, O = output, P = power, G = ground