SLVSEJ3B February   2018  – April 2018 TPSM84624

PRODUCTION DATA.  

  1. Features
  2. Applications
    1.     Simplified Schematic
  3. Description
    1.     Transient Response
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics (VIN = 12 V)
    8. 6.8 Typical Characteristics (VIN = 5 V)
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Switching Frequency (RT)
      3. 7.3.3  Synchronization (CLK)
      4. 7.3.4  Output On/Off Enable (EN)
      5. 7.3.5  Input Capacitor Selection
      6. 7.3.6  Output Capacitor Selection
      7. 7.3.7  TurboTrans (TT)
        1. 7.3.7.1 Low-ESR Output Capacitors
        2. 7.3.7.2 Transient Response
          1. 7.3.7.2.1 Transient Waveforms (VIN = 12 V)
      8. 7.3.8  Undervoltage Lockout (UVLO)
      9. 7.3.9  Soft Start (SS/TR)
      10. 7.3.10 Sequencing (SS/TR)
      11. 7.3.11 Power Good (PGOOD)
      12. 7.3.12 Safe Start-Up Into Pre-Biased Outputs
      13. 7.3.13 Overcurrent Protection
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Setting the Switching Frequency
        4. 8.2.2.4 Input Capacitors
        5. 8.2.2.5 Output Capacitors
        6. 8.2.2.6 TurboTrans Resistor
        7. 8.2.2.7 Application Waveforms
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 EMI
      1. 10.3.1 EMI Plots
    4. 10.4 Package Specifications
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Custom Design With WEBENCH® Tools
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Transient Waveforms (VIN = 12 V)

TPSM84624 3A0V8300220.gif
VOUT = 0.8 V COUT = 300 µF ceramic + 220 µF polymer
Figure 15. VOUT = 0.8 V, 3-A Load Step
TPSM84624 3A1V0200220.gif
VOUT = 1 V COUT = 200 µF ceramic + 220 µF polymer
Figure 17. VOUT = 1 V, 3-A Load Step
TPSM84624 3A1V2400.gif
VOUT = 1.2 V COUT = 400 µF ceramic
Figure 19. VOUT = 1.2 V, 3-A Load Step
TPSM84624 3A0V8300330.gif
VOUT = 0.8 V COUT = 300 µF ceramic + 330 µF polymer
Figure 16. VOUT = 0.8 V, 3-A Load Step
TPSM84624 3A1V0400220.gif
VOUT = 1 V COUT = 400 µF ceramic + 220 µF polymer
Figure 18. VOUT = 1 V, 3-A Load Step
TPSM84624 3A1V2400220.gif
VOUT = 1.2 V COUT = 400 µF ceramic + 220 µF polymer
Figure 20. VOUT = 1.2 V, 3-A Load Step