SLOS758G December   2011  – March 2020 TRF7963A

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Application Block Diagram
  2. 2Revision History
  3. 3Device Characteristics
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 Thermal Resistance Characteristics
    6. 5.6 Switching Characteristics
  6. 6Detailed Description
    1. 6.1  Functional Block Diagram
    2. 6.2  Power Supplies
    3. 6.3  Supply Arrangements
    4. 6.4  Supply Regulator Settings
    5. 6.5  Power Modes
    6. 6.6  Receiver – Analog Section
      1. 6.6.1 Main and Auxiliary Receiver
      2. 6.6.2 Receiver Gain and Filter Stages
    7. 6.7  Receiver – Digital Section
      1. 6.7.1 Received Signal Strength Indicator (RSSI)
        1. 6.7.1.1 Internal RSSI – Main and Auxiliary Receivers
        2. 6.7.1.2 External RSSI
    8. 6.8  Oscillator Section
    9. 6.9  Transmitter - Analog Section
    10. 6.10 Transmitter - Digital Section
    11. 6.11 Transmitter – External Power Amplifier or Subcarrier Detector
    12. 6.12 Communication Interface
      1. 6.12.1 General Introduction
      2. 6.12.2 FIFO Operation
      3. 6.12.3 Parallel Interface Mode
      4. 6.12.4 Reception of Air Interface Data
      5. 6.12.5 Data Transmission to MCU
      6. 6.12.6 Serial Interface Communication (SPI)
        1. 6.12.6.1 Serial Interface Mode Without Slave Select (SS)
        2. 6.12.6.2 Serial Interface Mode With Slave Select (SS)
      7. 6.12.7 Direct Mode
    13. 6.13 Direct Commands from MCU to Reader
      1. 6.13.1 Command Codes
      2. 6.13.2 Reset FIFO (0x0F)
      3. 6.13.3 Transmission With CRC (0x11)
      4. 6.13.4 Transmission Without CRC (0x10)
      5. 6.13.5 Block Receiver (0x16)
      6. 6.13.6 Enable Receiver (0x17)
      7. 6.13.7 Test Internal RF (RSSI at RX Input With TX On) (0x18)
      8. 6.13.8 Test External RF (RSSI at RX Input With TX Off) (0x19)
      9. 6.13.9 Register Preset
    14. 6.14 Register Description
      1. 6.14.1 Register Overview
        1. 6.14.1.1 Main Configuration Registers
          1. 6.14.1.1.1 Chip Status Control Register (0x00)
          2. 6.14.1.1.2 ISO Control Register (0x01)
        2. 6.14.1.2 Protocol Subsetting Registers
          1. 6.14.1.2.1 ISO14443B TX Options Register (0x02)
          2. 6.14.1.2.2 ISO14443A High-Bit-Rate and Parity Options Register (0x03)
          3. 6.14.1.2.3 TX Pulse Length Control Register (0x06)
          4. 6.14.1.2.4 RX No Response Wait Time Register (0x07)
          5. 6.14.1.2.5 RX Wait Time Register (0x08)
          6. 6.14.1.2.6 Modulator and SYS_CLK Control Register (0x09)
          7. 6.14.1.2.7 RX Special Setting Register (0x0A)
          8. 6.14.1.2.8 Regulator and I/O Control Register (0x0B)
        3. 6.14.1.3 Status Registers
          1. 6.14.1.3.1 IRQ Status Register (0x0C)
          2. 6.14.1.3.2 Collision Position and Interrupt Mask Registers (0x0D and 0x0E)
          3. 6.14.1.3.3 RSSI Levels and Oscillator Status Register (0x0F)
        4. 6.14.1.4 Test Registers
          1. 6.14.1.4.1 Test Register (0x1A)
          2. 6.14.1.4.2 Test Register (0x1B)
        5. 6.14.1.5 FIFO Control Registers
          1. 6.14.1.5.1 FIFO Status Register (0x1C)
          2. 6.14.1.5.2 TX Length Byte1 Register (0x1D) and TX Length Byte2 Register (0x1E)
  7. 7Applications, Implementation, and Layout
    1. 7.1 TRF7963A Reader System Using SPI With SS Mode
      1. 7.1.1 General Application Considerations
      2. 7.1.2 Schematic
    2. 7.2 System Design
      1. 7.2.1 Layout Considerations
      2. 7.2.2 Impedance Matching TX_Out (Pin 5) to 50 Ω
      3. 7.2.3 Reader Antenna Design Guidelines
  8. 8Device and Documentation Support
    1. 8.1 Getting Started and Next Steps
    2. 8.2 Device Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Export Control Notice
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Considerations

Keep all decoupling capacitors as close to the IC as possible, with the high-frequency decoupling capacitors (10 nF) closer than the low-frequency decoupling capacitors (2.2 µF).

Place ground vias as close as possible to the ground side of the capacitors and reader IC pins to minimize any possible ground loops.

It is not recommend using any inductor sizes below 0603 as the output power can be compromised. If smaller sized inductors are absolutely necessary, the designer must confirm output performance.

Pay close attention to the required load capacitance of the used crystal and adjust the two external shunt capacitors accordingly. Follow the recommendations of the crystal manufacturer for those values.

There should be a common ground plane for the digital and analog sections. The multiple ground sections or "islands" should have vias that tie the different sections of the planes together.

Ensure that the exposed thermal pad at the center of the IC is properly laid out. It should be tied to ground to help dissipate heat from the package.

Trace line lengths should be minimized whenever possible, particularly the RF output path, crystal connections, and control lines from the reader to the microprocessor. Proper placement of the TRF7963A, microprocessor, crystal, and RF connection/connector help facilitate this.

Avoid crossing of digital lines under RF signal lines. Also, avoid crossing of digital lines with other digital lines whenever possible. If the crossings are unavoidable, 90° crossings should be used to minimize coupling of the lines.

Depending on the production test plan, the designer should consider possible implementations of test pads or test vias for use during testing. The necessary pads and vias should be placed in accordance with the proposed test plan to help enable easy access to those test points.

If the system implementation is complex (for example, if the RFID reader module is a subsystem of a larger system with other modules such as Bluetooth®, Wi-Fi®, microprocessors, and clocks), special considerations should be taken to ensure that there is no noise coupling into the supply lines. If needed, special filtering or regulator considerations should be used to minimize or eliminate noise in these systems.

For more information and details on layout considerations, see the TRF796x HF-RFID Reader Layout Design Guide.