SLLS791D June   2007  – February 2024 TRS232E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Driver Section: Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Receiver Section: Electrical Characteristics
    9. 5.9 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
  10. 9 Device Documentation and Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)D (SOIC)DW (SOIC)N (PDIP)PW (TSSOP)UNIT
16 PINS16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance84.671.760.6107.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.537.448.138.4°C/W
RθJBJunction-to-board thermal resistance43.236.840.653.7°C/W
ψJTJunction-to-top characterization parameter10.413.27.53.2°C/W
ψJBJunction-to-board characterization parameter42.836.440.353.1°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.