SLLS862B August   2007  – October 2022 TRSF3243

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  Thermal Information
    4. 6.4  Electrical Characteristics
    5. 6.5  Electrical Characteristics: Driver
    6. 6.6  Switching Characteristics: Driver
    7. 6.7  Electrical Characteristics: Receiver
    8. 6.8  Switching Characteristics: Receiver
    9. 6.9  Electrical Characteristics: Auto-Powerdown
    10. 6.10 Switching Characteristics: Auto-Powerdown
      1.      Parameter Measurement Information
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Device Functional Modes
      1. 7.2.1 Function Tables
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Switching Characteristics: Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7-6)
PARAMETER TEST CONDITIONS(3) MIN TYP(1) MAX UNIT
Maximum data rate
(see Figure 7-1)		 RL = 3 kΩ,
One DOUT switching		 CL = 1000 pF 250 kbit/s
CL = 250 pF, VCC = 3 V to 4.5 V 1000
CL = 1000 pF, VCC = 4.5 V to 5.5 V 1000
tsk(p) Pulse skew(2) CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 7-2 25 ns
SR(tr) Slew rate,
transition region
(see Figure 7-1)		 CL = 150 pF to 1000 pF, RL = 3 kΩ to 7 kΩ, VCC = 3.3 V 18 150 V/μs
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(2) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
(3) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.