SCDS189H January   2005  – May 2018 TS3A5018

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for 3.3-V Supply
    6. 6.6  Electrical Characteristics for 2.5-V Supply
    7. 6.7  Electrical Characteristics for 2.1-V Supply
    8. 6.8  Electrical Characteristics for 1.8-V Supply
    9. 6.9  Switching Characteristics for 3.3-V Supply
    10. 6.10 Switching Characteristics for 2.5-V Supply
    11. 6.11 Switching Characteristics for 1.8-V Supply
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram (Each Switch)
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • DBQ|16
  • RGY|16
  • D|16
  • DGV|16
  • RSV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

D, DBQ, DGV and PW Package
16-Pin SOIC, SSOP, TVSOP and TSSOP
(Top View)
Logic Circuit
TS3A5018 po_circuit_scds189.gif
RGY Package
16-Pin VQFN
(Top View)
RSV Package
16-Pin UQFN
(Top View)

Pin Functions

PIN TYPE DESCRIPTION
NAME SOIC, SSOP, TVSOP, VQFN NO. UQFN NO.
COM1 4 2 I/O Common path for switch
COM2 7 5 I/O Common path for switch
COM3 9 7 I/O Common path for switch
COM4 12 10 I/O Common path for switch
EN 15 13 I Active-low switch enable input
GND 8 6 — Ground
IN 1 15 I Switch path selector input
NC1 2 16 I/O Normally closed path for switch
NC2 5 3 I/O Normally closed path for switch
NC3 11 9 I/O Normally closed path for switch
NC4 14 12 I/O Normally closed path for switch
NO1 3 1 I/O Normally open path for switch
NO2 6 4 I/O Normally open path for switch
NO3 10 8 I/O Normally open path for switch
NO4 13 11 I/O Normally open path for switch
V+ 16 14 — Supply voltage