SCDS328C October   2011  – August 2015 TS3USBA225

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Click and Pop Reduction
      2. 7.3.2 Negative Signal Swing Capability
    4. 7.4 Device Functional Modes
      1. 7.4.1 High Impedance (Hi-Z) Mode
        1. 7.4.1.1 Power-Down Mode
      2. 7.4.2 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)(2)(3)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage –0.3 6.0 V
VD0+, VD0-,
VD1+, VD1-		 High speed differential signal voltage –0.3 4.6 V
VR, VL Audio signal voltage – 1.9 4.6 V
IK Analog port diode current VI/O+ ,VI/O- < 0 –50 mA
VI Digital input voltage (SEL1, SEL2) –0.3 6.0 V
IIK Digital logic input clamp current(3) VI < 0 –50
ICC Continuous current through VCC 100 mA
IGND Continuous current through GND –100 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3) All voltages are with respect to ground, unless otherwise specified.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage range 2.7 5.0 V
VD0+, VD0-,
VD1+, VD1-		 High speed differential signal voltage range 0 4.5 V
VR, VL Audio signal voltage range when not in power-down mode –1.8 4.3 V or VCC(1) V
Audio signal voltage range when in power-down mode –1 1
IK Analog port diode current VI/O+ ,VI/O- < 0 –50 mA
VI Digital input voltage range (SEL1, SEL2) 0 VCC V
TA Operating free-air temperature –40 85 °C
(1) This rating is exclusive and the voltage on the pins must not exceed either 4.3 V or VCC. E.g. if VCC = 3.3 V the voltage on the pin must not exceed 3.3 V and if VCC is = 5.0 V the voltage on the pin must not exceed 4.3 V.

6.4 Thermal Information

THERMAL METRIC (1) TS3USBA225 UNIT
RUT (UQFN)
12 PINS
RθJA Junction-to-ambient thermal resistance 118.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.1 °C/W
RθJB Junction-to-board thermal resistance 47.9 °C/W
ψJT Junction-to-top characterization parameter 0.7 °C/W
ψJB Junction-to-board characterization parameter 47.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TA = –40°C to 85°C, typical values are at VCC = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MHL/USB SWITCH
ron ON-state resistance VCC = 3.0 V VI/O+,I/O- = 0.4 V, ION = 15 mA 6.5 7.5 Ω
Δron ON-state resistance match between channels VCC = 3.0 V VI/O+,I/O- = 1.7 V, ION = 15 mA 0.1 Ω
ron (flat) ON-state resistance flatness VCC = 3.0 V VI/O+,I/O- = 0 to 1.7 V, ION = 15 mA 0.5 Ω
IOZ OFF leakage current VCC = 3.6 V Switch OFF , VI/O+,I/O- = 0 to 3.6 V,
VD+/R, D-/L = 0 V		 1 µA
USB/AUDIO SWITCH
ron ON-state resistance VCC = 3.0 V SEL1 = High, SEL2 = Low,
VL/R = –1.8 V, 0 V, 0.7 V,
ION = –26 mA		 2.5 3.5 Ω
Δron ON-state resistance match between channels VCC = 3.0 V SEL1 = High, SEL2 = Low,
VL/R = 0.7 V, ION = –26 mA		 0.1 Ω
ron (flat) ON-state resistance flatness VCC = 3.0 V SEL1 = High, SEL2 = Low,
VL/R = –1.8 V, 0 V, 0.7 V, ION = –26 mA		 0.1 Ω
rSHUNT Shunt resistance VCC = 2.7 V to 5.0 V Switch OFF, VL/R = 0.7 V,
ISHUNT = 10 mA		 100 200 Ω
DIGITAL CONTROL INPUTS (SEL1, SEL2)
VIH Input logic high VCC = 3.3 V to 5.0 V 1.3 V
VIL Input logic low VCC = 2.7 V to 3.3 V 0.25 V
VCC = 3.3 V to 5.0 V 0.4
IIN Input leakage current VCC = 2.7 V to 5.0 V VIN = 5.0 V ±3 μA
VIN = 0 V ±0.1
rPD1, rPD2 Internal pulldown resistance VCC = 2.7 V to 5.0 V 3 MΩ

6.6 Dynamic Characteristics

TA = –40°C to 85°C, typical values are at VCC = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MHL/USB SWITCH
tpd Propagation Delay VCC = 2.7 V or 3.3 V 0.25 ns
tON Turn-on time RL = 50 Ω, CL = 35 pF VCC = 2.7 V 60 ns
tOFF Turn-off time RL = 50 Ω, CL = 35 pF VCC = 2.7 V 20 ns
tSK(O) Channel-to-channel skew VCC = 2.7 V or 3.3 V 15 ps
tSK(P) Skew of opposite transitions of same output VCC = 2.7 V or 3.3 V 15 ps
CI/O+(OFF)
CI/O-(OFF)		 OFF capacitance VCC = 2.7 V or 3.3 V,
VD0+/D0- =0 or 3.3 V		 Switch OFF 1 pF
CI/O+(ON)
CI/O-(ON)		 ON capacitance VCC = 2.7 V or 3.3 V,
VD0+/D0- = 0 or 3.3 V		 Switch ON 3 pF
CI Digital input capacitance VCC = 2.7 V or 3.3 V, VI = 0 or 3.3 V 2.5 pF
BW Bandwidth VCC = 2.7 V or 3.3 V, RL = 50 Ω Switch ON 1.9 GHz
OISO OFF Isolation VCC = 2.7 V or 3.3 V, RL = 50 Ω,
f = 240 MHz		 Switch OFF -35 dB
XTALK Crosstalk VCC = 2.5 V or 3.3 V, RL = 50 Ω,
f = 240 MHz		 Switch ON -45 dB
USB/AUDIO SWITCH
tON Turn-on time RL = 50 Ω, CL = 35 pF VCC = 2.7 V 40 µs
tOFF Turn-off time RL = 50 Ω, CL = 35 pF VCC = 2.7 V 15 ns
CL(OFF), CR(OFF) L , R OFF capacitance VCC = 2.7 V to 4.5 V, f = 20 kHz Switch OFF 1.0 pF
CL(ON), CR(ON) L, R ON capacitance VCC = 2.7 V to 4.5 V, f = 20 kHz Switch ON 3.5 pF
OISO OFF Isolation VCC = 3.3 V, RL = 50 Ω, f = 20 kHz Switch OFF -85 dB
XTALK Crosstalk VCC = 3.3 V, RL = 50 Ω, f = 20 kHz Switch ON -95 dB
THD Total harmonic distortion VCC = 3.3 V, SEL1 = High, SEL2 = Low,
f = 20 Hz to 20 kHz, RL = 600 Ω,
VIN = 2 Vpp		 Switch ON 0.05%
SUPPLY
VCC Power supply voltage 2.7 5.0 V
ICC Positive supply current VCC = 2.7 V, 3.6 V, 5.0 V VIN= VCC or GND, VI/O = 0 V,
Switch ON or OFF		 25 50 µA
ICC, PD Positive supply current (Power-Down Mode) VCC = 2.7 V, 3.6 V, 5.0 V, VI/O = 0 V,
SEL1 and SEL2 = Low		 3 5 µA
PSRR Power Supply Rejection Ratio VCC = 2.7 V, 3.6 V, 5.0 V VIN = VCC +/- 200 mVpp
RL = 50 Ω		 -60 dB
IOFF Power off leakage current VCC = 0 V, D+/R, D-/L, D0+, D0-, D1+, D1-, L,
VIN = 0 to 4.5 V		 ±0.1 µA

6.7 Typical Characteristics

TS3USBA225 G001_SCDS327.png
Figure 1. ON Resistance vs VI for MHL/USB Switch
TS3USBA225 G003_SCDS327.png
A.
Figure 3. Gain vs Frequency for MHL/USB Switch
TS3USBA225 G005_SCDS327.png
Figure 5. Off Isolation vs Frequency for MHL/USB Switch
TS3USBA225 D001_SCDS328.gif
Figure 7. ION, VCC = 2.7 V
TS3USBA225 D003_SCDS328.gif
Figure 9. ION, VCC = 5.0 V
TS3USBA225 D005_SCDS328.gif
Figure 11. IOFF, VCC = 3.3 V
TS3USBA225 G002_SCDS327.png
Figure 2. ON Resistance vs VI for USB/Audio Switch
TS3USBA225 G004_SCDS327.png
Figure 4. Gain vs Frequency for USB/Audio Switch
TS3USBA225 G006_SCDS327.png
Figure 6. Cross Talk vs Frequency for MHL/USB Switch
TS3USBA225 D002_SCDS328.gif
Figure 8. ION, VCC = 3.3 V
TS3USBA225 D004_SCDS328.gif
Figure 10. IOFF, VCC = 2.7 V
TS3USBA225 D006_SCDS328.gif
Figure 12. IOFF, VCC = 5.0 V