SCDS336C November   2012  – October 2016 TS5A3159-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 5-V Supply
    6. 6.6 Electrical Characteristics for 3.3-V Supply
    7. 6.7 Electrical Characteristics For 2.5-V Supply
    8. 6.8 Electrical Characteristics For 1.8-V Supply
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Parameter Measurement Information

Table 1. Parameter Description

SYMBOL DESCRIPTION
VCOM Voltage at COM
VNC Voltage at NC
VNO Voltage at NO
ron Resistance between COM and NC or COM and NO ports, when the channel is ON
rpeak Peak ON-state resistance over a specified voltage range
∆ron Difference of ron between channels
ron(flat) Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
INC(OFF) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state under worst-case input and output conditions
INO(OFF) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state under worst-case input and output conditions
INC(ON) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output (COM) being open
INO(ON) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output (COM) being open
ICOM(ON) Leakage current measured at the COM port, with the corresponding channel (COM to NO or COM to NC) in the ON state and the output (NC or NO) being open
VIH Minimum input voltage for logic high for the control input (IN)
VIL Minimum input voltage for logic low for the control input (IN)
VIN Voltage at IN
IIH, IIL Leakage current measured at IN
tON Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal, when the switch is turning ON.
tOFF Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal, when the switch is turning OFF.
tBBM Break-before-make time. This parameter is measured under the specified range of conditions and by the propagation delay between the output of two adjacent analog channels (NC and NO), when the control signal changes state.
QC Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC, NO, or COM) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input. Charge injection, QC = CL × ∆VO, CL is the load capacitance, and ∆VO is the change in analog output voltage.
CNC(OFF) Capacitance at the NC port when the corresponding channel (NC to COM) is OFF
CNO(OFF) Capacitance at the NO port when the corresponding channel (NO to COM) is OFF
CNC(ON) Capacitance at the NC port when the corresponding channel (NC to COM) is ON
CNO(ON) Capacitance at the NO port when the corresponding channel (NO to COM) is ON
CCOM(ON) Capacitance at the COM port when the corresponding channel (COM to NC or COM to NO) is ON
CIN Capacitance of IN
OISO OFF isolation of the switch is a measurement OFF-state switch impedance. This is measured in dB in a specific frequency, with the corresponding channel (NC to COM or NO to COM) in the OFF state.
XTALK Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC to NO or NO to NC). This is measured in a specific frequency and in dB.
BW Bandwidth of the switch. This is the frequency in which the gain of an ON channel is −3 dB below the DC gain.
I+ Static power-supply current with the control (IN) pin at V+ or GND
∆I+ This is the increase in I+ for each control (IN) input that is at the specified voltage, rather than at V+ or GND.
TS5A3159-Q1 Fig11_ON_State_Resistance_ron_SCDS336.gif Figure 9. On-State Resistance (ron)
TS5A3159-Q1 Fig12_OFF_State_Leakage_Current_INC_OFF_INO_OFF_SCDS336.gif Figure 10. Off-State Leakage Current (INC(OFF), INO(OFF))
TS5A3159-Q1 Fig13_ON_State_Leakage_Current_ICOM_ON_INC_ON_INO_ON_SCDS336.gif Figure 11. On-State Leakage Current (ICOM(ON), INC(ON), INO(ON))
TS5A3159-Q1 Fig14_Capacitance_CI_CCOM_ON_CNC_OFF_CON_OFF_CNC_ON_CON_ON_SCDS336.gif Figure 12. Capacitance (CI, CCOM(ON), CNC(OFF), CNO(OFF), CNC(ON), CNO(ON))
TS5A3159-Q1 Fig15_TurnOn_tON_and_TurnOFF_Time_tOFF_SCDS336.gif Figure 13. Turn-On (tON) and Turn-Off Time (tOFF)
TS5A3159-Q1 Fig16_Break_Before_Make_Time_tBBM_SCDS336.gif Figure 14. Break-Before-Make Time (tBBM)
TS5A3159-Q1 Fig17_Bandwidth_BW_SCDS336.gif Figure 15. Bandwidth (BW)
TS5A3159-Q1 Fig18_OFF_Isolation_OISO_SCDS336.gif Figure 16. OFF Isolation (OISO)
TS5A3159-Q1 Fig19_Crosstalk_XTALK_SCDS336.gif Figure 17. Crosstalk (XTALK)
TS5A3159-Q1 Fig20_Charge_Injection_QC_SCDS336.gif Figure 18. Charge Injection (QC)
TS5A3159-Q1 Fig21_Total_Harmonic_Distortion_THD_SCDS336.gif Figure 19. Total Harmonic Distortion (THD)