SLLSER3F December   2015  – December 2023 TUSB542

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics, Power Supply Currents
    6. 5.6  Electrical Characteristics, DC
    7. 5.7  Electrical Characteristics, Dynamic
    8. 5.8  Electrical Characteristics, AC
    9. 5.9  Timing Requirements
    10. 5.10 Switching Characteristics
    11. 5.11 Typical Characteristics
      1. 5.11.1 1-Inch Pre Channel
      2. 5.11.2 24-Inch Pre Channel
      3. 5.11.3 32-Inch Pre Channel
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Receiver Equalization
      2. 6.3.2 De-Emphasis Control and Output Swing
      3. 6.3.3 Automatic LFPS Detection
      4. 6.3.4 Automatic Power Management
    4. 6.4 Device Functional Modes
      1. 6.4.1 Disconnect Mode
      2. 6.4.2 U Modes
        1. 6.4.2.1 U0 Mode
        2. 6.4.2.2 U2/U3 Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications, USB Type-C Port SS MUX
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Typical Application: Switching USB SS Host or Device Ports
      1. 7.3.1 Design Requirements
      2. 7.3.2 Detailed Design Procedure
      3. 7.3.3 Application Curves
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RWQ|18
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision E (April 2017) to Revision F (December 2023)

  • Changed Junction temperature MIN value to –40 from -65 in the Absolute Maximum Ratings tableGo
  • Changed Junction temperature MAX value to 105 from 150 in the Absolute Maximum Ratings tableGo
  • Changed Storage temperature MAX value to 150 from 105 in the Absolute Maximum Ratings tableGo

Changes from Revision D (March 2017) to Revision E (April 2017)

  • Changed Feature From: Selectable Equalization, de-emphasis, and Output Swing To: Selectable Equalization up to 9dB, de-emphasis, and Output Swing up to 6dB Go
  • Deleted Feature: Automatic LFPS de-emphasis Control for USB 3.1 ComplianceGo
  • Changed Feature From: Can Support USB DFP, UFP or DRP Port To: Supports USB-C DFP, UFP or DRP PortGo
  • Changed Application From: USB Type-C SS Application To: USB 3.1 Gen 1 SS ApplicationGo
  • Changed the Simplified Schematic Go
  • Changed the first five paragraphs of the Overview sectionGo
  • Changed Figure 7-1 Go
  • Changed the Design Requirements and the Detailed Design Procedure section of Typical Applications, USB Type-C Port SS MUX sectionGo
  • Changed the Design Requirements and the Detailed Design Procedure section of Typical Application: Switching USB SS Host or Device Ports Go

Changes from Revision C (August 2016) to Revision D (March 2017)

  • Added a MIN value of –65 to the Storage temperature in the Absolute Maximum Ratings tableGo

Changes from Revision B (January 2016) to Revision C (August 2016)

  • Changed Pin 15 To: TX_AP+ and Pin 14 To: TX_AP- in the RWQ Package imageGo

Changes from Revision A (January 2016) to Revision B (January 2016)

  • Changed the RX_AP+ (pin 18) and RX_AP- (pin 17) I/O Type and Description to Diff output Go
  • Changed the TX_AP+ (pin 15) and RX_AP- (pin 14) I/O Type and Description to Diff input Go

Changes from Revision * (December 2015) to Revision A (January 2016)

  • Changed the TX_AP and RX_AP pins in the Simplified Schematic Go
  • Changed the RX_AP+, RX_AP- and TX_AP+, TX_PA- pins in the RWQ Package imageGo
  • Changed pin RX_AP+ number From: 15 To: 18Go
  • Changed pin RX_AP- number From: 14 To: 17Go
  • Changed pin TX_AP+ number From: 18 To: 15Go
  • Changed pin TX_AP- number From: 17 To: 14Go
  • Changed Table 6-1 Go
  • Changed Figure 6-1 Go
  • Changed the Section 6.2 Go
  • Changed location of pins SSTXP, SSTXN and SSRXP, SSRXN in Figure 7-2 Go