SGLS384A May   2008  – November 2022 UC2843A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 Thermal Information
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pulse-by-Pulse Current Limiting
      2. 7.3.2 Current Sense Circuit
      3. 7.3.3 Error Amplifier Configuration
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Oscillator
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Undervoltage Lockout (UVLO) Start-Up
      3. 7.4.3 UVLO Turnoff Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

  • Star grounding techniques must be used.
  • Current loops must be kept as short and narrow as possible.
  • The IC ground and power ground must meet at the return for the input bulk capacitor. Ensure that high frequency and high current from the power stage does not go through the signal ground paths.
  • A high-frequency bypass capacitor (C3) must be placed across VCC and GND pins as close as possible to the pins.
  • Resistor R8 and capacitor C7 form a low-pass filter for the current sense signal. C7 must be as close to CS and GND pins as possible.
  • Capacitor C5 must be as close to VREF and GND pins as possible.