SLUSF14 august   2023 UCC15241-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Safety Limiting Values
  9. 8 Safety-Related Certifications
  10. 9 Insulation Characteristics
  11. 10Typical Characteristics
  12. 11Detailed Description
    1. 11.1 Overview
    2. 11.2 Functional Block Diagram
    3. 11.3 Feature Description
      1. 11.3.1 Power Stage Operation
        1. 11.3.1.1 VDD-VEE Voltage Regulation
        2. 11.3.1.2 COM-VEE Voltage Regulation
        3. 11.3.1.3 Power Handling Capability
      2. 11.3.2 Output Voltage Soft Start
      3. 11.3.3 ENA and PG
      4. 11.3.4 Protection Functions
        1. 11.3.4.1 Input Undervoltage Lockout
        2. 11.3.4.2 Input Overvoltage Lockout
        3. 11.3.4.3 Output Undervoltage Protection
        4. 11.3.4.4 Output Overvoltage Protection
        5. 11.3.4.5 Overpower Protection
        6. 11.3.4.6 Overtemperature Protection
    4. 11.4 Device Functional Modes
  13. 12Application and Implementation
    1. 12.1 Application Information
    2. 12.2 Typical Application
      1. 12.2.1 Design Requirements
      2. 12.2.2 Detailed Design Procedure
        1. 12.2.2.1 Capacitor Selection
        2. 12.2.2.2 Single RLIM Resistor Selection
        3. 12.2.2.3 RDR Circuit Component Selection
        4. 12.2.2.4 Feedback Resistors Selection
      3. 12.2.3 Application Curves
    3. 12.3 System Examples
    4. 12.4 Power Supply Recommendations
    5. 12.5 Layout
      1. 12.5.1 Layout Guidelines
      2. 12.5.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  15. 14Mechanical, Packaging, and Orderable Information
  16. 15Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.6 Safety Limiting Values

PARAMETER TEST CONDITIONS MAX UNIT
IS Safety input rms current RθJA = 52.3 °C/W, VVIN = 27 V, TJ = 150 °C, TA = 25 °C, POUT = 2.5W (1) (2) 188 mA
RθJA = 52.3 °C/W, VVIN = 21 V, TJ = 150 °C, TA = 25 °C, POUT = 2.5W (1) (2) 250 mA
PS Safety power dissipation (input power - output power) RθJA = 52.3 °C/W,  TJ = 150 °C, TA = 25 °C (1) (2) 2.39 W
TS Safety temperature (1) (2) 150 °C
(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power dissipation respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA.
(2) The junction-to-air thermal resistance, RθJA, in the Thermal Information table is that of a device installed on a high-K JEDEC test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter: TJ = TA + RθJA × P, where P is the power dissipated in the device. TJ(max) = TS = TA + RθJA × PS, where TJ(max) is the maximum allowed junction temperature.