SLUSES4C March   2022  – May 2024 UCC27624-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Operating Supply Current
      2. 6.3.2 Input Stage
      3. 6.3.3 Enable Function
      4. 6.3.4 Output Stage
      5. 6.3.5 Low Propagation Delays and Tightly Matched Outputs
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 VDD and Undervoltage Lockout
        2. 7.2.2.2 Drive Current and Power Dissipation
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

UCC27624-Q1 D Package8-Pin SOICTop View Figure 4-1 D Package8-Pin SOICTop View
UCC27624-Q1 DGN Package8-Pin VSSOPTop View Figure 4-2 DGN Package8-Pin VSSOPTop View
UCC27624-Q1 DSD Package8-Pin WSONTop View Figure 4-3 DSD Package8-Pin WSONTop View
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME DGN DSD D
ENA 1 1 I Enable input for Channel A. Biasing ENA, LOW will disable Channel A output regardless of the state of INA. Pulling ENA, HIGH enables the Channel A output. If ENA is left floating, Channel A is enabled by default due to an internal pullup resistor. It is recommended to connect this pin to VDD if unused.
ENB 8 8 I Enable input for Channel B. Biasing ENB, LOW disables Channel B output regardless of the state of INB. Pulling ENB, HIGH enables the Channel B output. If ENB is left floating, Channel B is enabled by default due to an internal pullup resistor. It is recommended to connect this pin to VDD if unused.
GND 3 3 — Ground: All signals are referenced to this pin.
INA 2 2 I Input to Channel A. INA is the non-inverting input of the UCC27624-Q1 device. OUTA is held LOW if INA is unbiased or floating by default due to an internal pulldown resistor. Connect this pin to GND if unused.
INB 4 4 I Input to Channel B. INB is the non-inverting input of the UCC27624-Q1 device. OUTB is held LOW if INB is unbiased or floating by default due to an internal pulldown resistor. Connect this pin to GND if unused.
OUTA 7 7 O Channel A Output
OUTB 5 5 O Channel B Output
VDD 6 6 I Bias supply input. Bypass this pin with two ceramic capacitors, generally ≥ 1 μF and 0.1 μF, which are referenced to GND pin of this device.
Thermal Pad — — Connect to GND through large copper plane. This pad is not a low-impedance path to GND.
(1) I = Input; O = Output