SLLSER8I June   2017  – March 2024 UCC5310 , UCC5320 , UCC5350 , UCC5390

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Function
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications for D Package
    7. 6.7  Insulation Specifications for DWV Package
    8. 6.8  Safety-Related Certifications For D Package
    9. 6.9  Safety-Related Certifications For DWV Package
    10. 6.10 Safety Limiting Values
    11. 6.11 Electrical Characteristics
    12. 6.12 Switching Characteristics
    13. 6.13 Insulation Characteristics Curves
    14. 6.14 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Propagation Delay, Inverting, and Noninverting Configuration
      1. 7.1.1 CMTI Testing
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Supply
      2. 8.3.2 Input Stage
      3. 8.3.3 Output Stage
      4. 8.3.4 Protection Features
        1. 8.3.4.1 Undervoltage Lockout (UVLO)
        2. 8.3.4.2 Active Pulldown
        3. 8.3.4.3 Short-Circuit Clamping
        4. 8.3.4.4 Active Miller Clamp (UCC53x0M)
    4. 8.4 Device Functional Modes
      1. 8.4.1 ESD Structure
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Designing IN+ and IN– Input Filter
        2. 9.2.2.2 Gate-Driver Output Resistor
        3. 9.2.2.3 Estimate Gate-Driver Power Loss
        4. 9.2.2.4 Estimating Junction Temperature
      3. 9.2.3 Selecting VCC1 and VCC2 Capacitors
        1. 9.2.3.1 Selecting a VCC1 Capacitor
        2. 9.2.3.2 Selecting a VCC2 Capacitor
        3. 9.2.3.3 Application Circuits with Output Stage Negative Bias
      4. 9.2.4 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 PCB Material
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Certifications
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Revision History

Changes from Revision H (February 2024) to Revision I (March 2024)

  • Changed Certification Planned to Certification number: 40047657 in Safety-Related Certifications For DWV Package sectionGo

Changes from Revision G (December 2023) to Revision H (February 2024)

  • Changed CTI and Material Group values in insulation specifications and added table noteGo

Changes from Revision F (January 2019) to Revision G (December 2023)

  • Added UCC5350MC DWV packageGo

Changes from Revision E (October 2018) to Revision F (January 2019)

  • Deleted (UCC5390EC) from 2nd bullet. There are now three released wide-body devicesGo
  • Added DIN EN 61010-1 to Safety-Related CertificationsGo
  • Added "(Planned)" throughout Safety-Related Certifications bulletsGo
  • Changed "variants for pinout configuration and drive strength" with switch type information in descriptionGo
  • Changed creepage and clearance from 9 mm to 8.5 mm in Insulation Specifications and throughout datasheetGo
  • Added VDE and CQC certification for D package and UL file number for DWV package Go
  • Changed test condition for VOH Go
  • Changed a minor detail to the UCC53x0M figuresGo
  • Changed typical application circuit for E Version to include capacitors on negative bias Go

Changes from Revision D (May 2018) to Revision E (October 2018)

  • Changed UCC5310 DWV package from Preview to Final.Go
  • Changed UCC5320 DWV package from Preview to Final.Go

Changes from Revision C (February 2018) to Revision D (May 2018)

  • Changed marketing status of the UCC5390EC from Preview to Production. Go

Changes from Revision B (August 2017) to Revision C (February 2018)

  • Added UCC5350SBD, UCC5320SCDWV, UCC5310MCDWV, and UCC5390ECDWV devices to the datasheet Go
  • Changed Features, Applications, Description, and functional block diagram to include E and M version, and DWV package information.Go
  • Added UCC5350SB to the pin configuration and functionGo
  • Added minimum storage temperatureGo
  • Changed from VDE V 0884-10 to VDE V 0884-11 in insulation specifications and safety-related certification tableGo
  • Changed safety limiting valuesGo
  • Deleted test conditions for Supply CurrentsGo
  • Added Typical Curves and Test Conditions to include UCC5390 and UCC5350 informationGo
  • Deleted device I/O figure Go
  • Changed ESD figure Go
  • Added typical application circuit for SB-Q1Go
  • Changed variables in equation from RON/ROFF to RGON/RGOFFGo
  • Added UL online certification directory to the certification sectionGo

Changes from Revision A (June 2017) to Revision B (August 2017)

  • Changed minimum ambient operating temperature from –55°C to –40°C Go

Changes from Revision * (June 2017) to Revision A (June 2017)

  • Deleted 17 A from title which is available for future 10-A deviceGo