SBOS275G June   2003  – December 2015 VCA810

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 High Grade DC Characteristics: VS = ±5 V (VCA810AID)
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input and Output Range
      2. 8.3.2 Overdrive Recovery
      3. 8.3.3 Output Offset Error
      4. 8.3.4 Offset Adjustment
      5. 8.3.5 Gain Control
      6. 8.3.6 Gain Control and Teeple Point
      7. 8.3.7 Noise Performance
      8. 8.3.8 Input and ESD Protection
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
      1. 9.1.1 VCA810 Operation
      2. 9.1.2 Range-Finding TGC Amplifier
      3. 9.1.3 Wide-Range AGC Amplifier
      4. 9.1.4 Stabilized Wein-Bridge Oscillator
      5. 9.1.5 Low-Drift Wideband Log Amplifier
      6. 9.1.6 Voltage-Controlled Low-Pass Filter
      7. 9.1.7 Tunable Equalizer
      8. 9.1.8 Voltage-Controlled Band-Pass filter
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Analysis
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Demonstration Boards
        2. 12.1.1.2 Macromodels and Applications Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (December 2010) to G Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Changed DC Performance, Input offset current parameter unit from mA to nA in High Grade DC Characteristics tableGo

Changes from E Revision (August 2008) to F Revision

  • Deleted lead temperature specification from Absolute Maximum Ratings table Go
  • Corrected typo in Figure 34Go

Changes from D Revision (February, 2006) to E Revision

  • Changed storage temperature minimum value in Absolute Maximum Ratings table from –40°C to –65°CGo