JAJSFW1E June 2017 – March 2019 66AK2G12
PRODUCTION DATA.
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This section provides the thermal resistance characteristics for the ABY package used on this device.
The Thermal Design Guide for DSP and Arm Application Processors Application Report (SPRABI3) available from http://www.ti.com/lit/pdf/sprabi3 provides guidance for successful implementation of a thermal solution for system designs containing this device. This document provides background information on common terms and methods related to thermal solutions. TI only supports designs that follow system design guidelines contained in the application report.
For reliability and operability concerns, the maximum junction temperature of the Device has to be at or below the TJ value identified in Section 5.4, Recommended Operating Conditions.