JAJSJW6A January   2023  – December 2023 ADS9815 , ADS9817

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
        1. 6.3.1.1 Input Clamp Protection Circuit
        2. 6.3.1.2 Programmable Gain Amplifier (PGA)
        3. 6.3.1.3 Wide-Common-Mode Voltage Rejection Circuit
        4. 6.3.1.4 Gain Error Calibration
      2. 6.3.2 ADC Transfer Function
      3. 6.3.3 ADC Sampling Clock Input
      4. 6.3.4 Reference
        1. 6.3.4.1 Internal Reference Voltage
        2. 6.3.4.2 External Reference Voltage
      5. 6.3.5 Sample Synchronization
      6. 6.3.6 Data Interface
        1. 6.3.6.1 Data Clock Output
        2. 6.3.6.2 ADC Output Data Randomizer
        3. 6.3.6.3 Test Patterns for Data Interface
          1. 6.3.6.3.1 User-Defined Test Pattern
          2. 6.3.6.3.2 User-Defined Alternating Test Pattern
          3. 6.3.6.3.3 Ramp Test Pattern
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down
      2. 6.4.2 Reset
      3. 6.4.3 Initialization Sequence
      4. 6.4.4 Normal Operation
    5. 6.5 Programming
      1. 6.5.1 Register Write
      2. 6.5.2 Register Read
      3. 6.5.3 Multiple Devices: Daisy-Chain Topology for SPI Configuration
        1. 6.5.3.1 Register Write With Daisy-Chain
        2. 6.5.3.2 Register Read With Daisy-Chain
  8. Register Map
    1. 7.1 Register Bank 0
    2. 7.2 Register Bank 1
    3. 7.3 Register Bank 2
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Data Acquisition (DAQ) System
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 CMOS Data Interface
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Switching Characteristics

at AVDD_5V = 4.75 V to 5.25 V, VDD_1V8 = 1.75 V to 1.85 V, IOVDD = 1.15 V to 1.85 V, and maximum throughput (unless otherwise noted); minimum and maximum values at TA = -40°C to +125°C; typical values at TA = 25°C
PARAMETER TEST CONDITIONS MIN MAX UNIT
RESET
tPU Power-up time for device 25 ms
SPI INTERFACE TIMINGS (CONFIGURATION INTERFACE)
tden_CKDO Delay time: 8th SCLK rising edge to data enable 22 ns
tdz_CKDO Delay time: 24th SCLK rising edge to SDO going Hi-Z 50 ns
td_CKDO Delay time: SCLK falling edge to corresponding data valid on SDO 16 ns
tht_CKDO Delay time: SCLK falling edge to previous data valid on SDO 2 ns
CMOS DATA INTERFACE
tDCLK Data clock output DDR mode 10 ns
SDR mode 20
Clock duty cycle 45 55 %
toff_DCLKDO_r Time offset: DCLK rising to corresponding data valid DDR mode tDCLK / 4 – 1.5 tDCLK / 4 + 1.5 ns
toff_DCLKDO_f​ Time offset: DCLK falling to corresponding data valid DDR mode tDCLK / 4 – 1.5 tDCLK / 4 + 1.5 ns
td_DCLKDO​ Time delay: DCLK rising to corresponding data valid SDR mode –1 1 ns
td_SYNC_FCLK Time delay: SMPL_CLK falling edge with SYNC signal to corresponding FCLKOUT rising edge 3 4 tSMPL_CLK