SLUSBD1B MARCH   2013  – September 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Pin Configuration and Function
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 SMBus Timing Characteristics
    8. 5.8 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Switching Frequency Adjust
      2. 6.3.2  High Accuracy Current Sense Amplifiers
      3. 6.3.3  Charger Timeout
      4. 6.3.4  Input Over-Current Protection (ACOC)
      5. 6.3.5  Converter Over-Current Protection
      6. 6.3.6  Battery Over-Voltage Protection (BATOVP)
      7. 6.3.7  System Over-Voltage Protection (SYSOVP)
      8. 6.3.8  Thermal Shutdown Protection (TSHUT)
      9. 6.3.9  Adapter Over-Voltage Protection (ACOVP)
      10. 6.3.10 Adapter Detect and ACOK Output
      11. 6.3.11 ACFET/RBFET Control
      12. 6.3.12 DPM
      13. 6.3.13 Buck Converter Power up
    4. 6.4 Device Functional Modes
      1. 6.4.1 LDO Mode and Minimum System Voltage
      2. 6.4.2 PWM Mode Converter Operation
      3. 6.4.3 Continuous Conduction Mode (CCM)
      4. 6.4.4 Discontinuous Conduction Mode (DCM)
      5. 6.4.5 PFM Mode
      6. 6.4.6 Learn Mode
      7. 6.4.7 IDPM Disable at Battery Removal
    5. 6.5 Programming
      1. 6.5.1 SMBus Communication
        1. 6.5.1.1 SMBus Interface
          1. 6.5.1.1.1 Write-Word Format
          2. 6.5.1.1.2 Read-Word Format
        2. 6.5.1.2 SMBus Commands
        3. 6.5.1.3 Setting Charger Options
        4. 6.5.1.4 Setting the Charge Current
        5. 6.5.1.5 Setting the Max Charge Voltage
        6. 6.5.1.6 Setting the Minimum System Voltage
        7. 6.5.1.7 Setting Input Current
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Inductor Selection
        2. 7.2.2.2 Input Capacitor
        3. 7.2.2.3 Output Capacitor
        4. 7.2.2.4 Power MOSFETs Selection
        5. 7.2.2.5 Input Filter Design
      3. 7.2.3 Application Curves
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Device and Documentation Support

10.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

10.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

10.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

10.4 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

10.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.