JAJSFV9D September   2015  – July 2018 CC1310

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2改訂履歴
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RSM Package
    2. 4.2 Signal Descriptions – RSM Package
    3. 4.3 Pin Diagram – RHB Package
    4. 4.4 Signal Descriptions – RHB Package
    5. 4.5 Pin Diagram – RGZ Package
    6. 4.6 Signal Descriptions – RGZ Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  RF Characteristics
    6. 5.6  Receive (RX) Parameters, 861 MHz to 1054 MHz
    7. 5.7  Receive (RX) Parameters, 431 MHz to 527 MHz
    8. 5.8  Transmit (TX) Parameters, 861 MHz to 1054 MHz
    9. 5.9  Transmit (TX) Parameters, 431 MHz to 527 MHz
    10. 5.10 PLL Parameters
    11. 5.11 ADC Characteristics
    12. 5.12 Temperature Sensor
    13. 5.13 Battery Monitor
    14. 5.14 Continuous Time Comparator
    15. 5.15 Low-Power Clocked Comparator
    16. 5.16 Programmable Current Source
    17. 5.17 DC Characteristics
    18. 5.18 Thermal Characteristics
    19. 5.19 Timing and Switching Characteristics
      1. 5.19.1 Reset Timing
        1. Table 5-1 Reset Timing
      2. 5.19.2 Wakeup Timing
        1. Table 5-2 Wakeup Timing
      3. 5.19.3 Clock Specifications
        1. Table 5-3 24-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 32.768-kHz Crystal Oscillator (XOSC_LF)
        3. Table 5-5 48-MHz RC Oscillator (RCOSC_HF)
        4. Table 5-6 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.19.4 Flash Memory Characteristics
        1. Table 5-7 Flash Memory Characteristics
      5. 5.19.5 Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
    20. 5.20 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Main CPU
    3. 6.3  RF Core
    4. 6.4  Sensor Controller
    5. 6.5  Memory
    6. 6.6  Debug
    7. 6.7  Power Management
    8. 6.8  Clock Systems
    9. 6.9  General Peripherals and Modules
    10. 6.10 Voltage Supply Domains
    11. 6.11 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 TI Design or Reference Design
  8. 8デバイスおよびドキュメントのサポート
    1. 8.1  デバイスの項目表記
    2. 8.2  ツールとソフトウェア
    3. 8.3  ドキュメントのサポート
    4. 8.4  テキサス・インスツルメンツのローパワーRF Webサイト
    5. 8.5  追加情報
    6. 8.6  コミュニティ・リソース
    7. 8.7  商標
    8. 8.8  静電気放電に関する注意事項
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9メカニカル、パッケージ、および注文情報
    1. 9.1 パッケージ情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

2 改訂履歴

Changes from October 27, 2016 to July 13, 2018 (from C Revision () to D Revision)

Changes from October 28, 2015 to October 27, 2016 (from B Revision () to C Revision)

  • Added 「特長」の箇条書きのシステム内プログラム可能フラッシュに32KBおよび64KBをGo
  • Changed 「特長」の箇条書きRoHS準拠のパッケージを正しいピン数にGo
  • Changed CC1310ブロック図Go
  • Changed Figure 4-2, corrected typo in pin nameGo
  • Changed the table note in Section 5.1 from: VDDS to: groundGo
  • Changed ESD ratings for all pins in Section 5.2Go
  • Added OOK modulation power consumption to Section 5.4Go
  • Added OOK modulation sensitivity to Section 5.6Go
  • Added receive parameters for 431-MHz to 527-MHz band in Section 5.7Go
  • Added transmit parameters for 431-MHz to 527-MHz band in Section 5.9Go
  • Changed ADC reference voltage to correct value in Section 5.11Go
  • Added thermal characteristics for RHB and RSM packages in Section 5.18Go
  • Changed Standby MCU Current Consumption, 32-kHz Clock, RAM and MCU Retention by extending the temperatureGo
  • Changed BOD restriction footnote in Table 6-2—restriction does not apply to die revision B and laterGo
  • Added Section 6.10Go
  • Changed Figure 8-1Go

Changes from September 30, 2015 to October 28, 2015 (from A Revision () to B Revision)

  • Added the RSM and RHB packagesGo

Changes from August 31, 2015 to September 30, 2015 (from * Revision () to A Revision)

  • Changed デバイスのステータスを製品プレビューから量産データにGo
  • Removed the RSM and RHB packagesGo