JAJSNX1G November 1998 – October 2022 CD54HC240 , CD54HC244 , CD54HCT240 , CD54HCT241 , CD54HCT244 , CD74HC240 , CD74HC241 , CD74HC244 , CD74HCT240 , CD74HCT241 , CD74HCT244
PRODUCTION DATA
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
THERMAL METRIC | DW (SOIC) | DB (SSOP) | N (PDIP) | NS (SO) | PW (TSSOP) | UNIT | |
---|---|---|---|---|---|---|---|
20 PINS | 20 PINS | 20 PINS | 20 PINS | 20 PINS | |||
RθJA | Junction-to-ambient thermal resistance(1) | 109.1 | 122.7 | 84.6 | 113.4 | 131.8 | °C/W |
RθJC (top) | Junction-to-case (top) thermal resistance | 76 | 81.6 | 72.5 | 78.6 | 72.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 77.6 | 77.5 | 65.3 | 78.4 | 82.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 51.5 | 46.1 | 55.3 | 47.1 | 21.5 | °C/W |
ΨJB | Junction-to-board characterization parameter | 77.1 | 77.1 | 65.2 | 78.1 | 82.4 | °C/W |
RθJC (bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | N/A | °C/W |