JAJSU86C January   2004  – April 2024 CD74HCT4051-Q1

PRODUCTION DATA  

  1.   1
  2. 1特長
  3. 2アプリケーション
  4. 3概要
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Electrical Characteristics: HCT Devices
    4. 5.4 Switching Characteristics
    5. 5.5 Analog Channel Specifications
    6. 5.6 Typical Characteristics
  7. 6Parameter Measurement Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 ドキュメントの更新通知を受け取る方法
    3. 7.3 サポート・リソース
    4. 7.4 Trademarks
    5. 7.5 静電気放電に関する注意事項
    6. 7.6 用語集
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

パッケージ・オプション

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発注情報

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VCC – VEE(2) DC Supply voltage -0.5 10.5 V
VCC –0.5 7 V
VEE 0.5 -7 V
IIK  DC input diode current VI < – 0.5V or VI > VCC + 0.5V –20 20 mA
IOK  DC switch diode current VI < VEE – 0.5V or VI > VCC + 0.5V –20 20 mA
DC switch current VI < VEE – 0.5V or VI > VCC + 0.5V -25 25 mA
ICC DC VCC or ground current –50 50 mA
IEE DC VEE current –20 mA
RθJA Package thermal impedance(3) 91.6 °C/W
TJMAX
Maximum junction temperature		 150 °C
TLMAX
Maximum lead temperature		 Soldering 10 s 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The package thermal impedance is calculated in accordance with JESD 51-7