JAJSEY5 March   2018 CSD86336Q3D

PRODUCTION DATA.  

  1. 1特長
  2. 2アプリケーション
  3. 3概要
    1.     上面図
      1.      Device Images
  4. 4改訂履歴
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Power Block Performance
    5. 5.5 Electrical Characteristics – Q1 Control FET
    6. 5.6 Electrical Characteristics – Q2 Sync FET
    7. 5.7 Typical Power Block Device Characteristics
    8. 5.8 Typical Power Block MOSFET Characteristics
  6. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Equivalent System Performance
    2. 6.2 Power Loss Curves
    3. 6.3 Safe Operating Area (SOA) Curves
    4. 6.4 Normalized Curves
    5. 6.5 Calculating Power Loss and Safe Operating Area (SOA)
      1. 6.5.1 Design Example
      2. 6.5.2 Calculating Power Loss
      3. 6.5.3 Calculating SOA Adjustments
  7. 7Layout
    1. 7.1 Recommended Schematic Overview
    2. 7.2 Recommended PCB Design Overview
      1. 7.2.1 Electrical Performance
      2. 7.2.2 Thermal Performance
  8. 8デバイスおよびドキュメントのサポート
    1. 8.1 ドキュメントの更新通知を受け取る方法
    2. 8.2 コミュニティ・リソース
    3. 8.3 商標
    4. 8.4 静電気放電に関する注意事項
    5. 8.5 Glossary
  9. 9メカニカル、パッケージ、および注文情報
    1. 9.1 Q3Dパッケージの寸法
    2. 9.2 ピン構成
    3. 9.3 推奨ランド・パターン
    4. 9.4 推奨ステンシル

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.