JAJSFX3F august   2012  – april 2023 DLP9500

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  LVDS Timing Requirements
    8. 6.8  LVDS Waveform Requirements
    9. 6.9  Serial Control Bus Timing Requirements
    10. 6.10 Systems Mounting Interface Loads
    11. 6.11 Micromirror Array Physical Characteristics
    12. 6.12 Micromirror Array Optical Characteristics
    13. 6.13 Window Characteristics
    14. 6.14 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DLPC410 - Digital Controller for DLP Discovery 4100 Chipset
      2. 7.3.2 DLPA200 - DMD Micromirror Drivers
      3. 7.3.3 DLPR410 - PROM for DLP Discovery 4100 Chipset
      4. 7.3.4 DLP9500 - DLP 0.95 1080p 2xLVDS Type-A DMD 1080p DMD
        1. 7.3.4.1 DLP9500 1080p Chipset Interfaces
          1. 7.3.4.1.1 DLPC410 Interface Description
            1. 7.3.4.1.1.1 DLPC410 IO
            2. 7.3.4.1.1.2 Initialization
            3. 7.3.4.1.1.3 DMD Device Detection
            4. 7.3.4.1.1.4 Power Down
          2. 7.3.4.1.2 DLPC410 to DMD Interface
            1. 7.3.4.1.2.1 DLPC410 to DMD IO Description
            2. 7.3.4.1.2.2 Data Flow
          3. 7.3.4.1.3 DLPC410 to DLPA200 Interface
            1. 7.3.4.1.3.1 DLPA200 Operation
            2. 7.3.4.1.3.2 DLPC410 to DLPA200 IO Description
          4. 7.3.4.1.4 DLPA200 to DLP9500 Interface
            1. 7.3.4.1.4.1 DLPA200 to DLP9500 Interface Overview
      5. 7.3.5 Measurement Conditions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Single Block Mode
      2. 7.4.2 Dual Block Mode
      3. 7.4.3 Quad Block Mode
      4. 7.4.4 Global Block Mode
    5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
      2. 7.5.2 Numerical Aperture and Stray Light Control
      3. 7.5.3 Pupil Match
      4. 7.5.4 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Thermal Test Points
      2. 7.6.2 Micromirror Array Temperature Calculation - Lumens Based
      3. 7.6.3 Micromirror Array Temperature Calculation - Power Density Based
      4. 7.6.4 59
    7. 7.7 Micromirror Landed-On and Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Device Description
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Sequence (Handled by the DLPC410)
    2. 9.2 DMD Power-Up and Power-Down Procedures
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Impedance Requirements
      2. 10.1.2 PCB Signal Routing
      3. 10.1.3 Fiducials
      4. 10.1.4 PCB Layout Guidelines
        1. 10.1.4.1 DMD Interface
          1. 10.1.4.1.1 Trace Length Matching
        2. 10.1.4.2 DLP9500 Decoupling
          1. 10.1.4.2.1 Decoupling Capacitors
        3. 10.1.4.3 VCC and VCC2
        4. 10.1.4.4 DMD Layout
        5. 10.1.4.5 DLPA200
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Marking
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision E (March 2017) to Revision F (April 2023)

  • Changed Micromirror switching time typical value from 13 μs to 12.5 μs and removed 22 μs Max value. Go

Changes from Revision D (March 2017) to Revision E (March 2017)

  • ウィンドウ透過率を変更Go
  • マイクロミラーの反射率を変更Go
  • アレイの回折効率を変更Go
  • アレイの充填率を変更Go
  • 高速なパターン・レートを変更Go
  • Changed Recommended Operating Conditions table; split Environmental into 3 wavelength regions; simplified and reorganized the table footnotesGo
  • Changed Thermal Metric textGo
  • Changed Micromirror array optical efficiency Go
  • Changed Micromirror array fill factor Go
  • Changed Micromirror array diffraction efficiency Go
  • Changed Micromirror surface reflectivity Go
  • Changed Window transmission Go
  • Changed Window transmittance, Minimum Go
  • Changed Window transmittance, Average Go
  • Changed Micromirror Array Temperature Calculation to indicate that it is based on lumensGo
  • Added Micromirror Array Temperature Calculation based on powerGo

Changes from Revision C (September 2015) to Revision D (March 2017)

  • Removed '692' from Pin Configurations imageGo
  • Added RH name for relative humidity in Section 6.1 Go
  • Clarified TGRADIENT footnote in Section 6.1 Go
  • Changed Tstg to TDMD in Section 6.2 to conform to current nomenclatureGo
  • Changed typical micromirror crossover time to the time required to transition from mirror position to the other in Section 6.12 Go
  • Added typical micromirror switching time - 13 µs in Section 6.12 Go
  • Changed "Micromirror switching time" to "Array switching time" for clarity in Section 6.12 Go
  • Added clarification to Micromirror switching time at 400 MHz with global reset in Section 6.12 Go
  • Added "Digital Controller for Discovery 4100 chipset" to "DLPC410" headerGo
  • Changed "Flash Configuration PROM" heading to "DLPR410 PROM for DLP Discovery 4100 chipset" Go
  • Changed "DMD" heading to "DLP9500 - DLP 0.95 1080p 2xLVDS Type-A DMD 1080p DMDGo
  • Changed DLPC410, DLPR410, DLP9500 descriptions in Device Description section to match Feature Description sectionGo
  • Updated Figure 11-1 and Figure 11-2 Go
  • Added Section 11.3 tableGo

Changes from Revision B (July 2013) to Revision C (October 2014)

  • 「ESD 定格」表、「機能説明」セクション、「デバイスの機能モード」、「アプリケーションと実装」セクション、「電源に関する推奨事項」セクション、「レイアウト」セクション、「デバイスおよびドキュメントのサポート」セクション、「メカニカル、パッケージ、および注文情報」セクションを追加。 Go
  • 「特長」および「概要」セクションの表現を多少変更Go
  • Changed the name of Micromirror clocking pulse reset in Pin FunctionsGo
  • Changed ESD Ratings table to match new standardGo
  • Added Max Recommended DMD Temperature – Derating CurveGo
  • Moved Max Recommended DMD Temperature – Derating Curve to Go
  • Replaced Figure 6-4 .Go
  • Changed units from lbs to NGo
  • Added explanation for the15 MBRST lines to the DLP9500 from each DLPA200Go
  • Changed Thermal Test Point Location graphicGo
  • Added program interface to system interface list in Section 8.2.1 Go
  • Corrected number of banks of DMD mirrors to 15 in Section 8.2.1.1 Go
  • Removed link to DLP Discovery 4100 chipset datasheetGo