JAJSFJ1 May   2018 DLPA4000

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      システム・ブロック図
  4. 4 改訂履歴
  5. 5 概要（続き)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Parameters
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Description
    3. 8.3 Feature Description
      1. 8.3.1 Supply and Monitoring
        1. 8.3.1.1 Supply
        2. 8.3.1.2 Monitoring
          1. 8.3.1.2.1 Block Faults
          2. 8.3.1.2.2 Low Battery and UVLO
          3. 8.3.1.2.3 Thermal Protection
      2. 8.3.2 Illumination
        1. 8.3.2.1 Programmable Gain Block
        2. 8.3.2.2 LDO Illumination
        3. 8.3.2.3 Illumination Driver A
        4. 8.3.2.4 External MOSFETs
          1. 8.3.2.4.1 Gate series resistor (RG)
          2. 8.3.2.4.2 Gate series diode (DG)
          3. 8.3.2.4.3 Gate parallel capacitance (CG)
        5. 8.3.2.5 RGB Strobe Decoder
          1. 8.3.2.5.1 Break Before Make (BBM)
          2. 8.3.2.5.2 Openloop Voltage
          3. 8.3.2.5.3 Transient Current Limit
        6. 8.3.2.6 Illumination Monitoring
          1. 8.3.2.6.1 Power Good
          2. 8.3.2.6.2 RatioMetric Overvoltage Protection
      3. 8.3.3 External Power MOSFET Selection
        1. 8.3.3.1 Threshold Voltage
        2. 8.3.3.2 Gate Charge and Gate Timing
        3. 8.3.3.3 On-resistance RDS(on)
      4. 8.3.4 DMD Supplies
        1. 8.3.4.1 LDO DMD
        2. 8.3.4.2 DMD HV Regulator
        3. 8.3.4.3 DMD/DLPC Buck Converters
        4. 8.3.4.4 DMD Monitoring
          1. 8.3.4.4.1 Power Good
          2. 8.3.4.4.2 Overvoltage Fault
      5. 8.3.5 Buck Converters
        1. 8.3.5.1 LDO Bucks
        2. 8.3.5.2 General Purpose Buck Converters
        3. 8.3.5.3 Buck Converter Monitoring
          1. 8.3.5.3.1 Power Good
          2. 8.3.5.3.2 Overvoltage Fault
      6. 8.3.6 Auxiliary LDOs
      7. 8.3.7 Measurement System
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 SPI
      2. 8.5.2 Interrupt
      3. 8.5.3 Fast-Shutdown in Case of Fault
      4. 8.5.4 Protected Registers
      5. 8.5.5 Writing to EEPROM
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Component Selection for General-Purpose Buck Converters
    3. 9.3 System Example With DLPA4000 Internal Block Diagram
  10. 10Power Supply Recommendations
    1. 10.1 Power-Up and Power-Down Timing
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 LED Driver
        1. 11.1.1.1 PowerBlock Gate Control Isolation
        2. 11.1.1.2 VIN to PowerBlocks
        3. 11.1.1.3 Return Current from LEDs and RSense
        4. 11.1.1.4 RC Snubber
        5. 11.1.1.5 Capacitor Choice
      2. 11.1.2 General Purpose Buck 2
      3. 11.1.3 SPI Connections
      4. 11.1.4 RLIM Routing
      5. 11.1.5 LED Connection
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デバイスの項目表記
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.2.1 Design Requirements

A high resolution LED projector can be created by using a DLP chip set comprised of a 0.65 WXGA DMD (DLP650LE) or a 0.65 1080p DMD (DLP650NE), a DLPC4422 controller, and the DLPA4000 PMIC/LED Driver. The DLPC4422 does the digital image processing, the DLPA4000 provides the needed analog functions for the projector, and the DMD is the display device for producing the projected image. In addition to the three DLP chips in the chip set, other components is required. At a minimum a Flash part is needed to store the software and firmware to control the DLPC4422. The illumination light that is applied to the DMD is typically from red, green, and blue LEDs. These are often contained in three separate packages, but sometimes more than one color of LED die may be in the same package to reduce the overall size of the projector. Power MOSFETs are needed external to the DLPA4000 so that high LED currents can be supported. For connecting the DLPC4422 to the front end chip for receiving images, the parallel interface is typically used. Connect the front end chip to the parallel interface, I2C to input commands to the DLPC4422.

The DLPA4000 has three built-in buck switching regulators to serve as projector system power supplies. Two of the regulators are fixed to 1.1 V and 1.8 V for powering the DLP chip set. The remaining buck regulator is available for general purpose use and its voltages are programmable. The regulators can be used to a drive variable-speed fans or to power other projector chips such as the front-end chip. The only power supply needed at the DLPA4000 input is SYSPWR from an external DC power supply or internal battery. The entire projector can be turned on and off by using a single signal called PROJ_ON. When PROJ_ON is high, the projector turns on and begins displaying images. When PROJ_ON is set low, the projector turns off and draws just microamps of current on SYSPWR.