SBOS704B May   2015  – March 2016 DRV421

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fluxgate Sensor
      2. 7.3.2  Integrator-Filter Function and Compensation Loop Stability
      3. 7.3.3  H-Bridge Driver for Compensation Coil
      4. 7.3.4  Shunt Sense Amplifier
      5. 7.3.5  Overrange Comparator
      6. 7.3.6  Voltage Reference
      7. 7.3.7  Overload Detection and Control
      8. 7.3.8  Magnetic Core Demagnetization
      9. 7.3.9  Search Function
      10. 7.3.10 Error Flag
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Magnetic Core Design
      2. 8.1.2 Protection Recommendations
    2. 8.2 Typical Application
      1. 8.2.1 Closed-Loop Current Sensing Module
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Differential Closed-Loop Current Sensing Module
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Using the DRV421 in ±15-V Sensor Applications
  9. 9 Power-Supply Recommendations
    1. 9.1 Power-Supply Decoupling
    2. 9.2 Power-On Start Up and Brownout
    3. 9.3 Power Dissipation
      1. 9.3.1 Thermal Pad
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

  • DRV421EVM Users Guide, SLOU409
  • TIPD196 Design Guide, TIDUA92
  • Designing with the DRV421: Closed Loop Current Sensor Specifications, SLOA223
  • Designing with the DRV421: Control Loop Stability, SLOA224

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.