JAJSE68 November   2017 INA317

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Internal Offset Correction
      2. 7.4.2 Input Common-Mode Range
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Setting the Gain
        2. 8.2.2.2  Internal Offset Correction
        3. 8.2.2.3  Offset Trimming
        4. 8.2.2.4  Noise Performance
        5. 8.2.2.5  Input Bias Current Return Path
        6. 8.2.2.6  Input Common-Mode Range
        7. 8.2.2.7  Operating Voltage
        8. 8.2.2.8  Low Voltage Operation
        9. 8.2.2.9  Single-Supply Operation
        10. 8.2.2.10 Input Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 開発サポート
        1. 11.1.1.1 TINA-TI (無料のダウンロード・ソフトウェア)
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 商標
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Layout

10.1 Layout Guidelines

TI recommends paying attention to good layout practices. Keep traces short and use a printed-circuit-board (PCB) ground plane with surface-mount components placed as close to the device pins as possible. Place a 0.1-µF bypass capacitor as close as possible the supply pins. Apply these guidelines throughout the analog circuit to improve performance and reduce electromagnetic interference (EMI) susceptibility.

Instrumentation amplifiers vary in the susceptibility to radio-frequency interference (RFI). RFI is identified as a variation in offset voltage or DC signal levels with changes in the interfering RF signal. The INA317 device is designed to minimize susceptibility to RFI by incorporating passive RC filters with an 8-MHz corner frequency at the VIN+ and VIN– inputs. As a result, the INA317 device demonstrates low sensitivity compared to previous generation devices. However, strong RF fields can cause varied offset levels and may require additional shielding.

10.2 Layout Example

INA317 PCB-Layout-INA317.gif Figure 40. INA317 Layout