JAJSCV2E November   2016  – August 2023 ISO7730-Q1 , ISO7731-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Insulation Lifetime
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 用語集
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DBQ|16
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision D (October 2020) to Revision E (August 2023)

  • ドキュメント全体を通して標準名を以下のように変更：「DIN V VDE V 0884-11:2017-01」から「DIN EN IEC 60747-17 (VDE 0884-17)」Go
  • ドキュメント全体を通して、すべての標準名から標準リビジョンおよび年への参照を削除Go
  • Updated Thermal Characteristics, Safety Limiting Values, and Thermal Derating Curves to provide more accurate system-level thermal calculationsGo
  • Updated electrical and switching characteristics to match device performanceGo
  • Changed working voltage lifetime margin from: 87.5% to: 50%, minimum required insulation lifetime from: 37.5 years to: 30 years and insulation lifetime per TDDB from: 135 years to: 169 years per DIN EN IEC 60747-17 (VDE 0884-17)Go
  • Changed Figure 9-8 per DIN EN IEC 60747-17 (VDE 0884-17Go

Changes from Revision C (March 2020) to Revision D (October 2020)

Changes from Revision B (September 2018) to Revision C (March 2020)

  • ドキュメント全体を通して、編集およびレイアウトの変更を実施Go
  • 以下のように変更：「絶縁バリアの寿命：40 年超」から「1500VRMS の動作電圧で 100 年を超える予測寿命」(セクション 1)Go
  • セクション 1 に「最大 5000VRMS の絶縁定格」を追加Go
  • セクション 1 に「最大 12.8kV のサージ耐量」を追加Go
  • セクション 1 に「絶縁バリアの両側で ±8kV の IEC 61000-4-2 接触放電保護」を追加Go
  • UL 認定の箇条書き項目を以下のように変更：「UL 1577 準拠の 5000VRMS (DW) および 2500VRMS (DBQ) 絶縁定格」から「UL 1577 部品認定プログラム」に変更 (セクション 1)Go
  • 「セクション 1」の「DBQ-16 パッケージ・デバイスの CQC 認定を除き、すべて認定済み」の箇条書き項目を削除Go
  • 「セクション 2」セクションのアプリケーション一覧を更新Go
  • 図 3-1 を、単一の絶縁コンデンサの代わりに、チャネルごとに直列の 2 つの絶縁コンデンサを示すよう更新Go
  • Added "Contact discharge per IEC 61000-4-2" specification of ±8000 V in Section 6.2 tableGo
  • Added the following table note to Data rate specification in Section 6.3 table: "100 Mbps is the maximum specified data rate, although higher data rates are possible." Go
  • Changed VIORM value for DW-16 package From: "1414 VPK" To: "2121 VPK" in Section 6.6 table Go
  • Changed VIOWM value for DW-16 package AC voltage From: "1000 VRMS" To: "1500 VRMS" and DC voltage From: "1414 VDC" To: "2121 VDC" in Section 6.6 table Go
  • Added 'see Figure 9-8' to TEST CONDITIONS of VIOWM specification in Section 6.6 Go
  • Changed VIOSM TEST CONDITIONS From: "Test method per IEC 60065" To: "Test method per IEC 62368-1" in Section 6.6 tableGo
  • Updated certification information in Section 6.7 table Go
  • Corrected ground symbols for "Input (Devices with F suffix)" in Section 8.4.1 Go
  • Added Section 9.2.3.1 sub-section under Section 9.2.3 sectionGo
  • Added 'How to use isolation to improve ESD, EFT, and Surge immunity in industrial systems' application report to Section 12.1 section Go

Changes from Revision A (May 2017) to Revision B (June 2018)

  • ドキュメント全体を通して、DIN 認定番号と認定ステータスを変更Go
  • DBQ パッケージの絶縁定格を 2500VRMS から 3000VRMS に変更Go
  • Moved the HBM and CDM values from the Features section to the ESD Ratings tableGo
  • Added VTEST to the conditions for the maximum transient isolation voltage parameter in the Insulation Specifications tableGo
  • Changed the value for the DBQ package from 3600 VPK to 4242 VPK throughout the documentGo
  • Changed the method b1 Vini condition for apparent charge in the Insulation Specifications tableGo

Changes from Revision * (November 2016) to Revision A (May 2017)

  • Updated the Safety-Related Certifications tableGo
  • Changed the minimum CMTI from 40 to 85 in all Electrical Characteristics tables Go